Abstract
In electronic packaging, most researchers are mainly focused on the mechanical properties of Cu–Sn intermetallic compounds (IMCs) at room temperature; few studies have looked into the relationship between hardness, elastic modulus, and plasticity of IMCs and elevated temperature. The hardness, elastic modulus, and plasticity of Cu6Sn5 and Cu3Sn at 25–200 °C are investigated by the nanoindentation method. The results show that the hardnesses of Cu6Sn5 and Cu3Sn obey linear attenuation law with elevated temperature. The hardness of Cu6Sn5 is more sensitive to temperature than that of Cu3Sn. This is due to the fact that the melting point of Cu6Sn5 (415 °C) is lower than that of Cu3Sn (670 °C), Cu6Sn5 has a lower normalization temperature than that of Cu3Sn. The elastic modulus of Cu6Sn5 and Cu3Sn and temperature have a parabolic law at 25–200 °C. The elastic modulus of Cu6Sn5 is more sensitive to temperature. This is attributed to the fact that the lattice structure of Cu6Sn5 is changed from hexagonal lattice to monoclinic lattice, causing its volume to expand, thereby making it more sensitive to temperature. The plasticity factors of Cu6Sn5 and Cu3Sn meet the polynomial relationship with elevated temperature. The plasticity factors of Cu6Sn5 and Cu3Sn increase with increasing temperature, which will reduce the resistance to plastic deformation. This is attributed to the fact that the vacancy generated into the material is conducive to the dislocation movement, the dislocation movement will be more active so that the plasticity factors of Cu6Sn5 and Cu3Sn gradually increase.
Issue Section:
Research Papers
References
1.
Biela
,
J.
,
Schweizer
,
M.
,
Waffler
,
S.
, and
Kolar
,
J. W.
, 2011
, “
SiC Versus Si-Evaluation of Potentials for Performance Improvement of Inverter and DC-DC Converter Systems by SiC Power Semiconductors
,” IEEE Trans. Ind. Electron.
,
58
(7
), pp. 2872
–2882
.10.1109/TIE.2010.20728962.
Zhou
,
W. S.
,
Zhong
,
X. Q.
, and
Sheng
,
K.
, 2014
, “
High Temperature Stability and the Performance Degradation of SiC MOSFETs
,” IEEE Trans. Power Electron.
,
29
(5
), pp. 2329
–2337
.10.1109/TPEL.2013.22835093.
Wang
,
R.
,
Boroyevich
,
D.
,
Ning
,
P.
,
Wang
,
Z.
,
Wang
,
F.
,
Mattavelli
,
P.
,
Ngo
,
K. D. T.
, and
Rajashekara
,
K.
, 2013
, “
A High-Temperature Sic Three-Phase AC-DC Converter Design for >100/Spl Deg/C Ambient Temperature
,” IEEE Trans. Power Electron.
,
28
(1
), pp. 555
–572
.10.1109/TPEL.2012.21991314.
Liu
,
Y. C.
,
Teo
,
J. W. R.
,
Tung
,
S. K.
, and
Lam
,
S. K.
, 2008
, “
High-Temperature Creep and Hardness of Eutectic 80Au/20Sn Solder
,” J. Alloy. Compd.
,
448
(1–2
), pp. 340
–343
.10.1016/j.jallcom.2006.12.1425.
Yoon
,
J. W.
,
Chun
,
H. S.
, and
Jung
,
S. B.
, 2009
, “
Liquid-State and Solid-State Interfacial Reactions of Fluxless-Bonded Au-20Sn/ENIG Solder Joint
,” J. Alloy. Compd.
,
469
(1–2
), pp. 108
–115
.10.1016/j.jallcom.2008.01.0776.
Yu
,
F.
,
Cui
,
J. Z.
,
Zhou
,
Z. M.
,
Fang
,
K.
,
Johnson
,
R. W.
, and
Hamilton
,
M. C.
, 2017
, “
Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications
,” IEEE Trans. Power Electron.
,
32
(9
), pp. 7083
–7095
.10.1109/TPEL.2016.26311287.
Gillman
,
A.
,
Roelofs
,
M. J. G. H.
,
Matouš
,
K.
,
Kouznetsova
,
V. G.
,
Sluis
,
O. V. D.
, and
Maris
,
M. P. F. H. L. V.
, 2017
, “
Microstructure Statistics-Property Relations of Silver Particle-Based Interconnects
,” Mater. Des.
,
118
, pp. 304
–313
.10.1016/j.matdes.2017.01.0058.
Park
,
M. S.
,
Gibbons
,
S. L.
, and
Arroyave
,
R.
, 2012
, “
Phase-Field Simulations of Intermetallic Compound Growth in Cu/Sn/Cu Sandwich Structure Under Transient Liquid Phase Bonding Conditions
,” Acta Mater.
,
60
(18
), pp. 6278
–6287
.10.1016/j.actamat.2012.07.0639.
Bosco
,
N. S.
, and
Zok
,
F. W.
, 2005
, “
Strength of Joints Produced by Transient Liquid Phase Bonding in the Cu-Sn System
,” Acta Mater.
,
53
(7
), pp. 2019
–2027
.10.1016/j.actamat.2005.01.01310.
Zheng
,
X. Y.
,
Lee
,
H.
,
Weisgraber
,
T. H.
,
Shusteff
,
M.
,
Deotte
,
J.
,
Duoss
,
E. B.
,
Kuntz
,
J. D.
,
Biener
,
M. M.
,
Ge
,
Q.
,
Jackson
,
J. A.
,
Kucheyev
,
S. O.
,
Fang
,
N. X.
, and
Spadaccini
,
C. M.
, 2014
, “
Ultralight, Ultrastiff Mechanical Metamaterials
,” Science
,
344
(6190
), pp. 1373
–1377
.10.1126/science.125229111.
Espinosa
,
H. D.
,
Bernal
,
R. A.
, and
Minary
,
J. M.
, 2012
, “
A Review of Mechanical and Electromechanical Properties of Piezoelectric Nanowires
,” Adv. Mater.
,
24
(34
), pp. 4656
–4675
.10.1002/adma.20110481012.
Li
,
L.
, and
Ortiz
,
C.
, 2014
, “
Pervasive Nanoscale Deformation Twinning as a Catalyst for Efficient Energy Dissipation in a Bioceramic Armour
,” Nat. Mater.
,
13
(5
), pp. 501
–507
.10.1038/nmat392013.
Tsukamoto
,
H.
,
Dong
,
Z. G.
,
Huang
,
H.
,
Nishimura
,
T.
, and
Nogita
,
K.
, 2009
, “
Nanoindentation Characterization of Intermetallic Compounds Formed Between Sn-Cu(-Ni) Ball Grid Arrays and Cu Substrates
,” Mater. Sci. Eng. B
,
164
(1
), pp. 44
–50
.10.1016/j.mseb.2009.06.01314.
Deng
,
X.
,
Chawla
,
N.
,
Chawla
,
K. K.
,
Koopman
,
M.
, and
Chu
,
J. P.
, 2005
, “
Mechanical Behavior of Multilayered Nanoscale Metal-Ceramic Composites
,” Adv. Eng. Mater.
,
7
(12
), pp. 1099
–1108
.10.1002/adem.20050016115.
Shim
,
J. H.
,
Oh
,
C. S.
,
Lee
,
B. J.
, and
Lee
,
D. N.
, 1996
, “
Thermodynamic Assessment of the Cu-Sn System
,” Z. Metallkd.
,
87
, pp. 205
–212
. https://www.researchgate.net/publication/279898348_Thermodynamic_assessment_of_the_Cu-Sn_system16.
Marques
,
V. M. F.
,
Johnston
,
C.
, and
Grant
,
P. S.
, 2013
, “
Nanomechanical Characterization of Sn-Ag-Cu/Cu Joints—Part 1: Young's Modulus, Hardness and Deformation Mechanisms as a Function of Temperature
,” Acta Mater.
,
61
(7
), pp. 2460
–2470
.10.1016/j.actamat.2013.01.01917.
Lucas
,
J. P.
,
Rhee
,
H.
,
Guo
,
F.
, and
Subramanian
,
K. N.
, 2003
, “
Mechanical Properties of Intermetallic Compounds Associated With Pb-Free Solder Joints Using Nanoindentation
,” J. Electron. Mater.
,
32
(12
), pp. 1375
–1383
.10.1007/s11664-003-0104-418.
Yang
,
P. F.
,
Lai
,
Y. S.
,
Jian
,
S. R.
,
Chen
,
J.
, and
Chen
,
R. S.
, 2008
, “
Nanoindentation Identifications of Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Derived by Diffusion Couples
,” Mater. Sci. Eng. A
,
485
(1–2
), pp. 305
–310
.10.1016/j.msea.2007.07.09319.
Gao
,
F.
,
Nishikawa
,
H.
,
Takemoto
,
T.
, and
Qu
,
J. M.
, 2009
, “
Mechanical Properties Versus Temperature Relation of Individual Phases in Sn-3.0Ag-0.5Cu Lead-Free Solder Alloy
,” Microelectron. Reliab.
,
49
(3
), pp. 296
–302
.10.1016/j.microrel.2008.10.01020.
Wang
,
F. J.
,
Qian
,
Y. Y.
, and
Ma
,
X.
, 2005
, “
Measurement of Mechanical Properties of Sn-Ag-Cu Bulk Solder BGA Solder Joint Using Nanoindentation
,” Acta Metall. Sin.
,
41
(7
), pp. 775
–779
.http://www.jcscp.org/EN/abstract/abstract4356.shtml21.
Milman
,
Y. V.
,
Galanov
,
B. A.
, and
Chugunova
,
S. I.
, 1993
, “
Plasticity Characteristic Obtained Through Hardness Measurement
,” Acta Mater.
,
41
(9
), pp. 2523
–2532
.10.1016/0956-7151(93)90122-922.
Milman
,
Y. V.
,
Chugunova
,
S. I.
, and
Goncharova
,
I. V.
, 2009
, “
Plasticity Determined by Indentation and Theoretical Plasticity of Materials
,” Bull. Russ. Acad. Sci., Div. Chem. Sci.
,
73
, pp. 1215
–1221
.10.3103/S106287380909009323.
Wheeler
,
J. M.
,
Armstrong
,
D. E. J.
,
Heinz
,
W.
, and
Schwaiger
,
R.
, 2015
, “
High Temperature Nanoindentation: The State of the Art and Future Challenges
,” Curr. Opin. Solid State Mat. Sci.
,
19
(6
), pp. 354
–366
.10.1016/j.cossms.2015.02.00224.
Pathak
,
S.
,
Stojakovic
,
D.
,
Doherty
,
R.
, and
Kalidindi
,
S. R.
, 2009
, “
Importance of Surface Preparation on the Nano-Indentation Stress-Strain Curves Measured in Metals
,” J. Mater. Res.
,
24
(3
), pp. 1142
–1155
.10.1557/jmr.2009.013725.
Oliver
,
W. C.
, and
Pharr
,
G. M.
, 1992
, “
An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Experiments
,” J. Mater. Res.
,
7
(6
), pp. 1564
–1583
.10.1557/JMR.1992.156426.
Fields
,
R. J.
,
Low
,
S. R.
, and
Lucey
,
G. K.
, 1991
, “
Physical and Mechanical Properties of Intermetallic Compounds Commonly Found in Solder Joints
,” Met. Sci. Join.
, 20(15), pp. 165
–174
.https://www.metallurgy.nist.gov/mechanical_properties/solder_paper.html27.
Lotfian
,
S.
,
Molina-Aldareguia
,
J. M.
,
Yazzie
,
K. E.
,
Yazzie
,
K. E.
,
Llorca
,
J.
, and
Chawla
,
N.
, 2013
, “
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
,” J. Electron. Mater.
,
42
(6
), pp. 1085
–1091
.10.1007/s11664-013-2517-z28.
Mu
,
D.
,
Huang
,
H.
,
McDonald
,
S. D.
, and
Nogita
,
K.
, 2013
, “
Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures
,” J. Electron. Mater.
,
42
(2
), pp. 304
–311
.10.1007/s11664-012-2227-y29.
Mu
,
D.
,
Huang
,
H.
, and
Nogita
,
K.
, 2012
, “
Anisotropic Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5
,” Mater. Lett.
,
86
, pp. 46
–49
.10.1016/j.matlet.2012.07.01830.
Song
,
J. M.
,
Huang
,
B. R.
,
Liu
,
C. Y.
,
Lai
,
Y. S.
,
Chiu
,
Y. T.
, and
Huang
,
T. W.
, 2012
, “
Nanomechanical Responses of Intermetallic Phase at the Solder Joint Interface-Crystal Orientation and Metallurgical Effects
,” Mater. Sci. Eng. A
,
534
, pp. 53
–59
.10.1016/j.msea.2011.11.03731.
Song
,
J. M.
,
Su
,
C. W.
,
Lai
,
Y. S.
, and
Chiu
,
Y. T.
, 2010
, “
Time-Dependent Deformation Behavior of Interfacial Intermetallic Compound Layers in Electronic Solder Joints
,” J. Mater. Res.
,
25
(4
), pp. 629
–632
.10.1557/JMR.2010.008132.
Rosenthal
,
Y.
,
Stern
,
A.
,
Cohen
,
S. R.
, and
Eliezer
,
D.
, 2010
, “
Nanoindentation Measurements and Mechanical Testing of As-Soldered and Aged Sn-0.7Cu Lead-Free Miniature Joints
,” Mater. Sci. Eng. A
,
527
(16–17
), pp. 4014
–4020
.10.1016/j.msea.2010.03.00633.
Xu
,
L.
, and
Pang
,
J. H. L.
, 2006
, “
Nano-Indentation Characterization of Ni-Cu-Sn IMC Layer Subject to Isothermal Aging
,” Thin Solid Films
,
504
(1–2
), pp. 362
–366
.10.1016/j.tsf.2005.09.05634.
Zhou
,
W.
,
Liu
,
L. J.
, and
Wu
,
P.
, 2010
, “
Structural, Electronic and Thermo-Elastic Properties of Cu6Sn5 and Cu5Zn8 Intermetallic Compounds: First-Principles Investigation
,” Intermetallics
,
18
(5
), pp. 922
–928
.10.1016/j.intermet.2009.12.03235.
Chen
,
J.
,
Lai
,
Y. S.
,
Yang
,
P. F.
,
Ren
,
C. Y.
, and
Huang
,
D. J.
, 2009
, “
Structural and Elastic Properties of Cu6Sn5 and Cu3Sn From First-Principles Calculations
,” J. Mater. Res.
,
24
(7
), pp. 2361
–2372
.10.1557/jmr.2009.027336.
Yang
,
X. X.
,
Xiao
,
G. S.
,
Yuan
,
G. Z.
,
Li
,
Z. G.
, and
Shu
,
X. F.
, 2013
, “
Nanoindentation Identifications of Mechanical Properties of Cu6Sn5 Intermetallic Compounds Derived by Lead-Free Solder Joints
,” Rare Met. Mat. Eng.
,
2
, p. 021
.37.
Hertzberg
,
R. W.
, 1989
, Deformation and Fracture Mechanics of Engineering Materials
,
Wiley
,
New York
.38.
Ma
,
H. T.
, and
Suhling
,
J. C.
, 2009
, “
A Review of Mechanical Properties of Lead-Free Solders for Electronic Packaging
,” J. Mater. Sci.
,
44
(5
), pp. 1141
–1158
.10.1007/s10853-008-3125-939.
Laurila
,
T.
,
Vuorinen
,
V.
, and
Kivilahti
,
J. K.
, 2005
, “
Interfacial Reactions Between Lead-Free Solders and Common Base Materials
,” Mater. Sci. Eng. R: Rep.
,
49
(1–2
), pp. 1
–60
.10.1016/j.mser.2005.03.00140.
Larsson
,
A. K.
,
Stenberg
,
L.
, and
Lidin
,
S.
, 1994
, “
The Superstructure of Domain-Twinned η'-Cu6Sn5
,” Acta Crystallogr., Sect. B: Struct. Sci.
,
50
(6
), pp. 636
–643
.10.1107/S010876819400405241.
Hwang
,
C. W.
,
Suganuma
,
K.
,
Lee
,
J. G.
, and
Mori
,
H.
, 2003
, “
Interface Microstructure Between Fe-42Ni Alloy and Pure Sn
,” J. Mater. Res.
,
18
(5
), pp. 1202
–1210
.10.1557/JMR.2003.016542.
Ghosh
,
G.
, and
Asta
,
M.
, 2005
, “
Phase Stability, Phase Transformations, and Elastic Properties of Cu6Sn5: Ab Initio Calculations and Experimental Results
,” J. Mater. Res.
,
20
(11
), pp. 3102
–3117
.10.1557/JMR.2005.0371Copyright © 2020 by ASME
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