Multiaxial and uniaxial vibration experiments were conducted in order to study the differences in failure modes and fatigue life for the two types of excitation. An electrodynamic (ED) shaker capable of controlled vibration in six degrees of freedom (DOF) was employed for the experiments. The test specimen consisted of six large inductors insertion mounted on a printed wiring board (PWB). Average damage accumulation rate (DAR) in the inductor leads was measured for random excitations in-plane, out-of-plane, and both directions simultaneously. Under simultaneous multiaxial excitation, the average DAR was found to be 2.2 times greater than the sum of the in-plane and out-of-plane DARs. The conclusion was that multiple-step sequential uniaxial testing may significantly overestimate the durability of large/heavy structures with high center of mass in a multiaxial dynamic environment. Additionally, a test method utilizing uniaxial vibration along a direction other than the principal directions of the structure was examined. This method was found to have significant limitations, but showed better agreement with simultaneous multiaxial vibration experiments.
Skip Nav Destination
U. S. Army Research Laboratory,
Aberdeen Proving Ground,
e-mail: ed.m.habtour.civ@mail.mil
Aberdeen Proving Ground,
e-mail: michael.f.pohland.civ@mail.mil
Directorate at Ft. Eustis,
e-mail: mark.e.robeson.civ@mail.mil
Article navigation
March 2015
Research-Article
Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations
Ed Habtour,
U. S. Army Research Laboratory,
Aberdeen Proving Ground,
e-mail: ed.m.habtour.civ@mail.mil
Ed Habtour
Vehicle Technology Directorate
,U. S. Army Research Laboratory,
Aberdeen Proving Ground,
MD 21005
e-mail: ed.m.habtour.civ@mail.mil
Search for other works by this author on:
Abhijit Dasgupta,
Abhijit Dasgupta
Center for Advanced Life Cycle Engineering,
e-mail: dasgupta@umd.edu
University of Maryland
,College Park, MD 20742
e-mail: dasgupta@umd.edu
Search for other works by this author on:
Michael Pohland,
Aberdeen Proving Ground,
e-mail: michael.f.pohland.civ@mail.mil
Michael Pohland
U.S. Army Materiel System Activity Analysis
,Aberdeen Proving Ground,
MD 21005
e-mail: michael.f.pohland.civ@mail.mil
Search for other works by this author on:
Mark Robeson,
Directorate at Ft. Eustis,
e-mail: mark.e.robeson.civ@mail.mil
Mark Robeson
U.S. Army's Aviation Development
Directorate at Ft. Eustis,
Ft. Eustis, VA 23604
e-mail: mark.e.robeson.civ@mail.mil
Search for other works by this author on:
Mark Paulus
Mark Paulus
Search for other works by this author on:
Matthew Ernst
Ed Habtour
Vehicle Technology Directorate
,U. S. Army Research Laboratory,
Aberdeen Proving Ground,
MD 21005
e-mail: ed.m.habtour.civ@mail.mil
Abhijit Dasgupta
Center for Advanced Life Cycle Engineering,
e-mail: dasgupta@umd.edu
University of Maryland
,College Park, MD 20742
e-mail: dasgupta@umd.edu
Michael Pohland
U.S. Army Materiel System Activity Analysis
,Aberdeen Proving Ground,
MD 21005
e-mail: michael.f.pohland.civ@mail.mil
Mark Robeson
U.S. Army's Aviation Development
Directorate at Ft. Eustis,
Ft. Eustis, VA 23604
e-mail: mark.e.robeson.civ@mail.mil
Mark Paulus
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 26, 2014; final manuscript received August 24, 2014; published online October 15, 2014. Assoc. Editor: Satish Chaparala.
This work is in part a work of the U.S. Government. ASME disclaims all interest in the U.S. Government's contributions.
J. Electron. Packag. Mar 2015, 137(1): 011009 (8 pages)
Published Online: October 15, 2014
Article history
Received:
June 26, 2014
Revision Received:
August 24, 2014
Citation
Ernst, M., Habtour, E., Dasgupta, A., Pohland, M., Robeson, M., and Paulus, M. (October 15, 2014). "Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations." ASME. J. Electron. Packag. March 2015; 137(1): 011009. https://doi.org/10.1115/1.4028516
Download citation file:
Get Email Alerts
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Related Articles
Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
J. Electron. Packag (March,2018)
Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking
J. Electron. Packag (December,2018)
A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load
J. Electron. Packag (December,2001)
Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation
J. Electron. Packag (March,2009)
Related Proceedings Papers
Related Chapters
FAILURE ANALYSIS OF A STRESS-BASED PIPELINE UNDER PLASTIC STRAIN
Pipeline Integrity Management Under Geohazard Conditions (PIMG)
Tales of the JEDEC Knight
More Hot Air