Thermoelectric generators (TEGs) can significantly improve the net power consumption and battery life of the low power mobile devices or high performance devices by generating power from their waste heat. Recent advancements also show that the ultrathin thermoelectric devices can be fabricated and integrated within a micro-electronic package. This work investigates the power generation by an ultrathin TEG embedded within a micro-electronic package considering several key parameters such as load resistance, chip heat flux, and proximity of the TEG to chip. The analysis shows that the power generation from TEGs increases with increasing background heat flux on chip or when TEGs are moved closer to the chip. An array of embedded TEGs is considered in order to analyze the influence of multiple TEGs on total power generation and conversion efficiency. Increasing the number of TEGs from one to nine increases the useful power generation from 72.9 mW to 378.4 mW but decreases the average conversion efficiency from 0.47% to 0.32%. The average power generated per TEG gradually decrease from 72.9 mW to 42.0 mW when number of TEGs is increased from one to nine, but the total useful power generated using nine TEGs is significant and emphasize the benefits of using embedded TEGs to reduce net power consumption in electronics packages.
Issue Section:
Research Papers
References
1.
Bell
, L. E.
, 2008
, “Cooling, Heating, Generating Power, and Recovering Waste Heat With Thermoelectric Systems
,” Science
, 321
(5895
), pp. 1457
–1461
.10.1126/science.11588992.
DiSalvo
, F. J.
, 1999
, “Thermoelectric Cooling and Power Generation
,” Science
, 285
(5428
), pp. 703
–706
.10.1126/science.285.5428.7033.
Thacher
, E. F.
, Helenbrook
, B. T.
, Karri
, M. A.
, and Richter
, C. J.
, 2007
, “Testing of an Automobile Exhaust Thermoelectric Generator in a Light Truck
,” Proc. Inst. Mech. Eng., Part D
, 221
(D1
), pp. 95
–107
.10.1243/09544070JAUTO514.
Wang
, Z. Y.
, Leonov
, V.
, Fiorini
, P.
, and Van Hoof
, C.
, 2009
, “Realization of a Wearable Miniaturized Thermoelectric Generator for Human Body Applications
,” Sens. Actuators
, A, 156
(1
), pp. 95
–102
.10.1016/j.sna.2009.02.0285.
Zhao
, L.-D.
, Lo
, S.-H.
, Zhang
, Y.
, Sun
, H.
, Tan
, G.
, Uher
, C.
, Wolverton
, C.
, Dravid
, V. P.
, and Kanatzidis
, M. G.
, 2014
, “Ultralow Thermal Conductivity and High Thermoelectric Figure of Merit in SnSe Crystals
,” Nature
, 508
(7496
), pp. 373
–377
.10.1038/nature131846.
Crane
, D. T.
, LaGrandeur
, J. W.
, Harris
, F.
, and Bell
, L. E.
, 2009
, “Performance Results of a High-Power-Density Thermoelectric Generator: Beyond the Couple
,” J. Electron. Mater.
, 38
(7
), pp. 1375
–1381
.10.1007/s11664-009-0674-x7.
Solbrekken
, G. L.
, Yazawa
, K.
, and Bar-Cohen
, A.
, 2008
, “Heat Driven Cooling of Portable Electronics Using Thermoelectric Technology
,” IEEE Trans. Adv. Packag.
, 31
(2
), pp. 429
–437
.10.1109/TADVP.2008.9203568.
Xie
, G.
, Chen
, Z.
, Sunden
, B.
, and Zhang
, W.
, 2012
, “Numerical Predictions of the Flow and Thermal Performance of Water-Cooled Single-Layer and Double-Layer Wavy Microchannel Heat Sinks
,” Numer. Heat Transfer, Part A
, 63
(3
), pp. 201
–225
.10.1080/10407782.2013.7304459.
Xie
, G.
, Liu
, J.
, Zhang
, W.
, and Sunden
, B.
, 2012
, “Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling
,” ASME J. Electron. Packag.
, 134
(4
), p. 041010
.10.1115/1.402303510.
Xie
, G.
, Liu
, J.
, Liu
, Y.
, Sunden
, B.
, and Zhang
, W.
, 2013
, “Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling
,” ASME J. Electron. Packag.
, 135
(2
), p. 021008
.10.1115/1.402353011.
Chowdhury
, I.
, Prasher
, R.
, Lofgreen
, K.
, Chrysler
, G.
, Narasimhan
, S.
, Mahajan
, R.
, Koester
, D.
, Alley
, R.
, and Venkatasubramanian
, R.
, 2009
, “On-Chip Cooling by Superlattice-Based Thin-Film Thermoelectrics
,” Nat. Nanotechnol.
, 4
(4
), pp. 235
–238
.10.1038/nnano.2008.41712.
Venkatasubramanian
, R.
, Siivola
, E.
, Colpitts
, T.
, and O'Quinn
, B.
, 2001
, “Thin-Film Thermoelectric Devices With High Room-Temperature Figures of Merit
,” Nature
, 413
(6856
), pp. 597
–602
.10.1038/3509801213.
Venkatasubramanian
, R.
, Watkins
, C.
, Stokes
, D.
, Posthill
, J.
, and Caylor
, C.
, 2007
, “Energy Harvesting for Electronics With Thermoelectric Devices Using Nanoscale Materials
,” IEEE International Electron Devices Meeting
(IEDM 2007
), Washington
, DC
, December 10–12, pp. 367
–370
.10.1109/IEDM.2007.441894814.
Strasser
, M.
, Aigner
, R.
, Lauterbach
, C.
, Sturm
, T. F.
, Franosh
, M.
, and Wachutka
, G.
, 2003
, “Micromachined CMOS Thermoelectric Generators as On-Chip Power Supply
,” 12th International Conference on Transducers, Solid-State Sensors, Actuators and Microsystems
, Boston, MA, June 8–12, pp. 45
–48
.10.1109/SENSOR.2003.121524915.
Li
, Y.
, Buddharaju
, K.
, Singh
, N.
, Lo
, G. Q.
, and Lee
, S. J.
, 2011
, “Chip-Level Thermoelectric Power Generators Based on High-Density Silicon Nanowire Array Prepared With Top-Down CMOS Technology
,” IEEE Electron Device Lett.
, 32
(5
), pp. 674
–676
.10.1109/LED.2011.211463416.
Min
, C.
, Rosendahl
, L. A.
, Condra
, T. J.
, and Pedersen
, J. K.
, 2009
, “Numerical Modeling of Thermoelectric Generators With Varing Material Properties in a Circuit Simulator
,” IEEE Trans. Energy Convers.
, 24
(1
), pp. 112
–124
.10.1109/TEC.2008.200531017.
Xiao
, H.
, Gou
, X. L.
, and Yang
, C.
, 2008
, “Simulation Analysis on Thermoelectric Generator System Performance
,” 7th International Conference on System Simulation and Scientific Computing
(ICSC 2008
), Beijing, China, October 10–12, pp. 1183
–1187
.10.1109/ASC-ICSC.2008.467554618.
Chen
, M.
, Rosendahl
, L. A.
, and Condra
, T.
, 2011
, “A Three-Dimensional Numerical Model of Thermoelectric Generators in Fluid Power Systems
,” Int. J. Heat Mass Transfer
, 54
(1–3
), pp. 345
–355
.10.1016/j.ijheatmasstransfer.2010.08.02419.
Crane
, D. T.
, Kossakovski
, D.
, and Bell
, L. E.
, 2009
, “Modeling the Building Blocks of a 10% Efficient Segmented Thermoelectric Power Generator
,” J. Electron. Mater.
, 38
(7
), pp. 1382
–1386
.10.1007/s11664-009-0673-y20.
Gould
, C. A.
, Shammas
, N. Y. A.
, Grainger
, S.
, and Taylor
, I.
, 2011
, “Thermoelectric Cooling of Microelectronic Circuits and Waste Heat Electrical Power Generation in a Desktop Personal Computer
,” Mater. Sci. Eng., B
, 176
(4
), pp. 316
–325
.10.1016/j.mseb.2010.09.01021.
Snyder
, G. J.
, and Ursell
, T. S.
, 2003
, “Thermoelectric Efficiency and Compatibility
,” Phys. Rev. Lett.
, 91
(14
), p. 148301
.10.1103/PhysRevLett.91.14830122.
Gupta
, M. P.
, Sayer
, M. H.
, Mukhopadhyay
, S.
, and Kumar
, S.
, 2011
, “Ultrathin Thermoelectric Devices for On-Chip Peltier Cooling
,” IEEE Trans. Compon., Packag. Manuf. Technol.
, 1
(9
), pp. 1395
–1405
.10.1109/TCPMT.2011.215930423.
Sullivan
, O.
, Gupta
, M. P.
, Mukhopadhyay
, S.
, and Kumar
, S.
, 2012
, “Array of Thermoelectric Coolers for On-Chip Thermal Management
,” ASME J. Electron. Packag.
, 134
(2
), p. 021005.10.1115/1.400614124.
Rowe
, D. M.
, 1995
, CRC Handbook of Thermoelectrics
, Taylor & Francis
, New York.25.
Sullivan
, O.
, Alexandrov
, B.
, Mukhopadhyay
, S.
, and Kumar
, S.
, 2012
, “Compact Model of Thermoelectric Coolers on a Micro-Electronic Chip
,” ASME
Paper No. IMECE2011-64881.10.1115/IMECE2011-64881Copyright © 2015 by ASME
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