Effective air flow distribution through perforated tiles is required to efficiently cool servers in a raised floor data center. We present detailed computational fluid dynamics (CFD) modeling of air flow through a perforated tile and its entrance to the adjacent server rack. The realistic geometrical details of the perforated tile, as well as of the rack are included in the model. Generally, models for air flow through perforated tiles specify a step pressure loss across the tile surface, or porous jump model based on the tile porosity. An improvement to this includes a momentum source specification above the tile to simulate the acceleration of the air flow through the pores, or body force model. In both of these models, geometrical details of tile such as pore locations and shapes are not included. More details increase the grid size as well as the computational time. However, the grid refinement can be controlled to achieve balance between the accuracy and computational time. We compared the results from CFD using geometrical resolution with the porous jump and body force model solution as well as with the measured flow field using particle image velocimetry (PIV) experiments. We observe that including tile geometrical details gives better results as compared to elimination of tile geometrical details and specifying physical models across and above the tile surface. A modification to the body force model is also suggested and improved results were achieved.
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September 2013
Research-Article
Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center
Vaibhav K. Arghode,
Vaibhav K. Arghode
1
Post-Doctoral Fellow
George W. Woodruff School of Mechanical Engineering,
e-mail: vaibhav.arghode@me.gatech.edu
George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
e-mail: vaibhav.arghode@me.gatech.edu
1Corresponding author.
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Pramod Kumar,
Pramod Kumar
Department of Mechanical Engineering,
Indian Institute of Science
,Bangalore, Kamataka 560012
, India
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Yogendra Joshi,
Yogendra Joshi
George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
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Gary Meyer
Gary Meyer
Triad Floors, Inc.
,Denver, CO 80202
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Vaibhav K. Arghode
Post-Doctoral Fellow
George W. Woodruff School of Mechanical Engineering,
e-mail: vaibhav.arghode@me.gatech.edu
George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
e-mail: vaibhav.arghode@me.gatech.edu
Pramod Kumar
Department of Mechanical Engineering,
Indian Institute of Science
,Bangalore, Kamataka 560012
, India
Yogendra Joshi
George W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology
,Atlanta, GA 30332
Gary Meyer
Triad Floors, Inc.
,Denver, CO 80202
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the Journal of Electronic Packaging. Manuscript received August 10, 2012; final manuscript received July 9, 2013; published online July 24, 2013. Assoc. Editor: Saurabh Shrivastava.
J. Electron. Packag. Sep 2013, 135(3): 030902 (7 pages)
Published Online: July 24, 2013
Article history
Received:
August 10, 2012
Revision Received:
July 9, 2013
Citation
Arghode, V. K., Kumar, P., Joshi, Y., Weiss, T., and Meyer, G. (July 24, 2013). "Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center." ASME. J. Electron. Packag. September 2013; 135(3): 030902. https://doi.org/10.1115/1.4024994
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