Board-level thermomechanical fatigue lifetimes of five different wafer-level chip scale packages (WCSPs) with lead-free solder joints were studied by both experiment and finite element method modeling. The effect of three different constitutive laws of the lead-free solder, namely Anand viscoplasticity, power law break-down creep, and time-hardening creep are also investigated for each of the five packages. The fatigue correlation parameters based on the increment of volume-averaged inelastic strain energy density are deduced for each of the corresponding three constitutive laws. It is demonstrated that the relative error of the predicted lifetime for WCSP with lead-free solder joints can be within 10% compared with experiment. It is found that the fatigue correlation parameters depend strongly on the specific constitutive law. Another important finding is that the fatigue correlation parameters depend on the specific package family. It is also demonstrated that when fatigue correlation parameters calibrated for other package families are applied to WCSPs, the error in predicted lifetimes is consistently large.
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March 2010
Research Papers
Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
Jie-Hua Zhao,
e-mail: jhzhao@ti.com
Jie-Hua Zhao
Texas Instruments Incorporated
, 13536 North Central Expressway, MS940, Dallas TX 75243
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Vikas Gupta,
Vikas Gupta
Texas Instruments Incorporated
, 13536 North Central Expressway, MS940, Dallas TX 75243
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Alok Lohia,
Alok Lohia
Texas Instruments Incorporated
, 13536 North Central Expressway, MS940, Dallas TX 75243
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Darvin Edwards
Darvin Edwards
Texas Instruments Incorporated
, 13536 North Central Expressway, MS940, Dallas TX 75243
Search for other works by this author on:
Jie-Hua Zhao
Texas Instruments Incorporated
, 13536 North Central Expressway, MS940, Dallas TX 75243e-mail: jhzhao@ti.com
Vikas Gupta
Texas Instruments Incorporated
, 13536 North Central Expressway, MS940, Dallas TX 75243
Alok Lohia
Texas Instruments Incorporated
, 13536 North Central Expressway, MS940, Dallas TX 75243
Darvin Edwards
Texas Instruments Incorporated
, 13536 North Central Expressway, MS940, Dallas TX 75243J. Electron. Packag. Mar 2010, 132(1): 011005 (6 pages)
Published Online: March 4, 2010
Article history
Received:
December 17, 2008
Revised:
September 30, 2009
Online:
March 4, 2010
Published:
March 4, 2010
Citation
Zhao, J., Gupta, V., Lohia, A., and Edwards, D. (March 4, 2010). "Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages." ASME. J. Electron. Packag. March 2010; 132(1): 011005. https://doi.org/10.1115/1.4000754
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