Microprocessors continue to grow in capabilities, complexity, and performance. Microprocessors typically integrate functional components such as logic and level two cache memory in their architecture. This functional integration of logic and memory results in improved performance of the microprocessor. However, the integration also introduces a layer of complexity in the thermal design and management of microprocessors. As a direct result of functional integration, the power map on a microprocessor is typically highly nonuniform, and the assumption of a uniform heat flux across the die surface has been shown to be invalid post Pentium II architecture. The active side of the die is divided into several functional blocks with distinct power assigned to each functional block. Previous work (Kaisare et al., 2005, “Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die,” InterPACK 2005, San Francisco, CA, Jul. 17–22) has been done, which includes numerical analysis and thermal based optimization of a typical package consisting of a nonuniformly powered die, heat spreader, thermal interface materials I and II, and the base of the heat sink. In this paper, an analytical approach to temperature distribution of a first level package with a nonuniformly powered die is carried out for the first time. The analytical model for two-layer bodies developed by Haji-Sheikh et al. (2003, “Steady-State Heat Conduction in Multi-Layer Bodies,” Int. J. Heat Mass Transfer, 46(13), pp. 2363–2379) is extended to this typical package, which is a multilayer body. The solution is to begin by designating each surface heat flux as a volumetric heat source. An inverse methodology is applied to solve the equations for various surfaces to calculate the maximum junction temperature for a given multilayer body. Finally validation of the analytical solution is carried out using previously developed numerical model.
Skip Nav Destination
e-mail: kaisare@mech.uta.edu
Article navigation
March 2009
Research Papers
Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die
Abhijit Kaisare,
Abhijit Kaisare
Department of Mechanical and Aerospace Engineering, Electronics, MEMS and Nano Systems Packaging Center,
e-mail: kaisare@mech.uta.edu
University of Texas at Arlington
, Arlington, TX 76010
Search for other works by this author on:
Dereje Agonafer,
Dereje Agonafer
Department of Mechanical and Aerospace Engineering, Electronics, MEMS and Nano Systems Packaging Center,
University of Texas at Arlington
, Arlington, TX 76010
Search for other works by this author on:
A. Haji-Sheikh,
A. Haji-Sheikh
Department of Mechanical and Aerospace Engineering, Electronics, MEMS and Nano Systems Packaging Center,
University of Texas at Arlington
, Arlington, TX 76010
Search for other works by this author on:
Greg Chrysler,
Greg Chrysler
Intel Corporation
, 5000 W. Chandler Blvd., Chandler, AZ 85226
Search for other works by this author on:
Ravi Mahajan
Ravi Mahajan
Intel Corporation
, 5000 W. Chandler Blvd., Chandler, AZ 85226
Search for other works by this author on:
Abhijit Kaisare
Department of Mechanical and Aerospace Engineering, Electronics, MEMS and Nano Systems Packaging Center,
University of Texas at Arlington
, Arlington, TX 76010e-mail: kaisare@mech.uta.edu
Dereje Agonafer
Department of Mechanical and Aerospace Engineering, Electronics, MEMS and Nano Systems Packaging Center,
University of Texas at Arlington
, Arlington, TX 76010
A. Haji-Sheikh
Department of Mechanical and Aerospace Engineering, Electronics, MEMS and Nano Systems Packaging Center,
University of Texas at Arlington
, Arlington, TX 76010
Greg Chrysler
Intel Corporation
, 5000 W. Chandler Blvd., Chandler, AZ 85226
Ravi Mahajan
Intel Corporation
, 5000 W. Chandler Blvd., Chandler, AZ 85226J. Electron. Packag. Mar 2009, 131(1): 011005 (7 pages)
Published Online: February 12, 2009
Article history
Received:
November 18, 2007
Revised:
May 15, 2008
Published:
February 12, 2009
Citation
Kaisare, A., Agonafer, D., Haji-Sheikh, A., Chrysler, G., and Mahajan, R. (February 12, 2009). "Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die." ASME. J. Electron. Packag. March 2009; 131(1): 011005. https://doi.org/10.1115/1.3068303
Download citation file:
Get Email Alerts
Cited By
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink
J. Electron. Packag (September,2002)
Numerical Analysis of Transient Temperature Distribution Inside a Current Transformer
J. Thermal Sci. Eng. Appl (September,2010)
Conjugate Heat Transfer From a Two-Layer Substrate Model of a Convectively Cooled Circuit Board
J. Electron. Packag (June,2001)
Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication
J. Electron. Packag (December,2004)
Related Proceedings Papers
Related Chapters
Special Thermal Problems
Pipe Stress Engineering
Experimental Investigation of an Improved Thermal Response Test Equipment for Ground Source Heat Pump Systems
Inaugural US-EU-China Thermophysics Conference-Renewable Energy 2009 (UECTC 2009 Proceedings)
Ultra High-Speed Microbridge Chaos Domain
Intelligent Engineering Systems Through Artificial Neural Networks, Volume 17