While most recently electronic cooling studies have been focused on removing the heat from high-power-density devices, the present study also explores means of greatly decreasing the device operating temperature. This is achieved by incorporating a microchannel heat sink as an evaporator in an R134a refrigeration loop. This system is capable of maintaining device temperatures below while dissipating in excess of . It is shown that while higher heat transfer coefficients are possible with greater mass velocities, those conditions are typically associated with wet compression corresponding to evaporator exit quality below unity and liquid entrainment at the compressor inlet. Wet compression compromises compressor performance and reliability as well as refrigeration cycle efficiency and therefore must be minimized by maintaining only slightly superheated conditions at the compressor inlet, or using a wet-compression-tolerant compressor. A parametric study of the effects of channel geometry on heat sink performance points to channels with small width and high aspect ratio as yielding superior thermal performance corresponding to only a modest penalty in pressure drop.
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e-mail: mudawar@ecn.purdue.edu
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March 2006
Research Papers
Implementation of Microchannel Evaporator for High-Heat-Flux Refrigeration Cooling Applications
Jaeseon Lee,
Jaeseon Lee
Purdue University International Electronic Cooling Alliance
, West Lafayette, IN 47907
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Issam Mudawar
e-mail: mudawar@ecn.purdue.edu
Issam Mudawar
Purdue University International Electronic Cooling Alliance
, West Lafayette, IN 47907
Search for other works by this author on:
Jaeseon Lee
Purdue University International Electronic Cooling Alliance
, West Lafayette, IN 47907
Issam Mudawar
Purdue University International Electronic Cooling Alliance
, West Lafayette, IN 47907e-mail: mudawar@ecn.purdue.edu
J. Electron. Packag. Mar 2006, 128(1): 30-37 (8 pages)
Published Online: June 17, 2005
Article history
Received:
September 7, 2004
Revised:
June 17, 2005
Citation
Lee, J., and Mudawar, I. (June 17, 2005). "Implementation of Microchannel Evaporator for High-Heat-Flux Refrigeration Cooling Applications." ASME. J. Electron. Packag. March 2006; 128(1): 30–37. https://doi.org/10.1115/1.2159006
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