Numerical predictive accuracy is assessed for board-mounted electronic component heat transfer in free convection, using a computational fluid dynamics code dedicated to the thermal analysis of electronic equipment. This is achieved by comparing numerical predictions with experimental measurements of component junction temperature and component-PCB surface temperature, measured using thermal test chips and infrared thermography, respectively. The printed circuit board (PCB) test vehicle considered is populated with fifteen 160-lead PQFP components generating a high degree of component thermal interaction. Component numerical modeling is based on vendor-specified, nominal package dimensions and material thermophysical properties. To permit both the modeling methodology applied and solver capability to be carefully evaluated, test case complexity is incremented in controlled steps, from individually to simultaneously powered component configurations. Component junction temperature is predicted overall to within (7%) of measurement, independently of component location on the board. However, component thermal interaction is found not to be fully captured.
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e-mail: veveloy@calce.umd.edu
e-mail: rodgers@calce.umd.edu
e-mail: saleem.hashmi@dcu.ie
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September 2005
Research Papers
Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free Convection
Valérie Eveloy,
Valérie Eveloy
CALCE Electronic Products and Systems Center,
e-mail: veveloy@calce.umd.edu
University of Maryland
, College Park, MD 20742
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Peter Rodgers,
Peter Rodgers
CALCE Electronic Products and Systems Center,
e-mail: rodgers@calce.umd.edu
University of Maryland
, College Park, MD 20742
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M. S. J. Hashmi
M. S. J. Hashmi
School of Mechanical and Manufacturing Engineering,
e-mail: saleem.hashmi@dcu.ie
Dublin City University
, Collins Avenue, Dublin 9, Ireland
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Valérie Eveloy
CALCE Electronic Products and Systems Center,
University of Maryland
, College Park, MD 20742e-mail: veveloy@calce.umd.edu
Peter Rodgers
CALCE Electronic Products and Systems Center,
University of Maryland
, College Park, MD 20742e-mail: rodgers@calce.umd.edu
M. S. J. Hashmi
School of Mechanical and Manufacturing Engineering,
Dublin City University
, Collins Avenue, Dublin 9, Irelande-mail: saleem.hashmi@dcu.ie
J. Electron. Packag. Sep 2005, 127(3): 245-254 (10 pages)
Published Online: June 26, 2004
Article history
Received:
January 21, 2003
Revised:
June 26, 2004
Citation
Eveloy, V., Rodgers, P., and Hashmi, M. S. J. (June 26, 2004). "Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free Convection." ASME. J. Electron. Packag. September 2005; 127(3): 245–254. https://doi.org/10.1115/1.1938988
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