Surface Nusselt numbers, pressure coefficients, and flow visualizations are presented which are measured as a turbulent jet, with a fully developed velocity profile, impinges on the cylindrical pedestal and on the surrounding flat surface. Thermochromic liquid crystals and shroud-transient techniques are used to measure spatially resolved surface temperature distributions, which are used to deduce local Nusselt numbers. Dimensionless pedestal heights are 0, 0.5, 1.0, and 1.5, the jet Reynolds number Re is 23,000, and the surface distance to nozzle diameter ranges from 2 to 10. Local Nusselt numbers drastically increase with a radial distance away from the stagnation point on top of the pedestal for values of 0.5, 1.0, and 1.5. These are partially due to the small flow recirculation zones present on top of the pedestal, and mixing associated with the separation of flow streamlines near the edge of the upper surface on the pedestal. Local Nusselt numbers are also augmented at flat surface locations corresponding to positions where shear layers reattach downstream of the pedestal. In general, augmentation magnitudes become more pronounced as becomes smaller because of greater vortex influences. Corresponding local Nusselt numbers, beneath shear layer reattachment locations for H/D=0.5, are 35 to 80% higher than values measured at the same flat surface locations when no pedestals are employed.
Skip Nav Destination
Article navigation
June 2005
Research Papers
Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins
Y. S. Chung,
Y. S. Chung
Samsung Electronics Co., Ltd., 416, Maetan3-dong, Paldal-gu, Suwon, Gyeonggi-do, 442-742 Korea
Search for other works by this author on:
D. H. Lee,
D. H. Lee
School of Mechanical and Automotive Engineering, Inje University, 607 Obang-dong, Gimhae, Gyongnam 621-749 Korea
Search for other works by this author on:
P. M. Ligrani
P. M. Ligrani
Convective Heat Transfer Laboratory, Department of Mechanical Engineering, University of Utah. Salt Lake City, Utah 84112-9208 USA
Search for other works by this author on:
Y. S. Chung
Samsung Electronics Co., Ltd., 416, Maetan3-dong, Paldal-gu, Suwon, Gyeonggi-do, 442-742 Korea
D. H. Lee
School of Mechanical and Automotive Engineering, Inje University, 607 Obang-dong, Gimhae, Gyongnam 621-749 Korea
P. M. Ligrani
Convective Heat Transfer Laboratory, Department of Mechanical Engineering, University of Utah. Salt Lake City, Utah 84112-9208 USA
Contributed by the Electronic and Photonic Pacaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 3, 2003; revision received July 7, 2004. Review conducted by: B. Courtois.
J. Electron. Packag. Jun 2005, 127(2): 106-112 (7 pages)
Published Online: June 3, 2005
Article history
Received:
September 3, 2003
Revised:
July 7, 2004
Online:
June 3, 2005
Citation
Chung, Y. S., Lee, D. H., and Ligrani, P. M. (June 3, 2005). "Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins ." ASME. J. Electron. Packag. June 2005; 127(2): 106–112. https://doi.org/10.1115/1.1849235
Download citation file:
Get Email Alerts
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Related Articles
Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
J. Electron. Packag (September,2007)
Flow Visualization of Axisymmetric Impinging Jet on a Concave Surface
J. Heat Transfer (August,2018)
Three-Dimensional Heat Transfer of a Confined Circular Impinging Jet With Buoyancy Effects
J. Heat Transfer (April,2003)
Novel Jet Impingement Cooling Geometry for Combustor Liner Backside Cooling
J. Thermal Sci. Eng. Appl (June,2009)
Related Proceedings Papers
Related Chapters
Cavitating Structures at Inception in Turbulent Shear Flow
Proceedings of the 10th International Symposium on Cavitation (CAV2018)
Cooling of a Chip Utilizing a Heat Sink with Rectangular Fins
Everyday Heat Transfer Problems: Sensitivities to Governing Variables
Theoretical Investigation of Pressure in Transient Reversed Stagnation-Point Flow
International Conference on Mechanical and Electrical Technology, 3rd, (ICMET-China 2011), Volumes 1–3