The thermo-mechanical integration of polymer films requires a precise knowledge of material properties. Nanoindentation is a widely used testing method for the determination of material properties of thin films such as Young’s modulus and the hardness. An important assumption in the analysis of the indentation is that the indented medium is a semi-infinite plane or half space, i.e., it has an “infinite thickness.” In nanoindentation the analyzed material is often a thin film that is deposited on a substrate. If the modulus ratio is small, (soft film on hard substrate) and the penetration depth is small too, then the Hertzian assumption does not hold. We investigate this situation with spherical and conical indentation. Measurement results are shown using spherical indentation on a visco-elastic thin polymer film and a full visco-elastic characterization is presented.

1.
Sneddon
,
I. N.
,
1965
,
Int. J. Eng. Sci.
,
3
, pp.
47
57
.
2.
Shull
,
K. R.
,
2002
, “
Contact Mechanics and the Adhesion of Soft Solids
,”
Mater. Sci. Eng., R.
,
36
, pp.
1
45
.
3.
Chudoba
,
T.
,
Schwarzer
,
N.
, and
Richter
,
F.
,
1999
, “
New Possibilities of Mechanical Surface Characterization
,”
Thin Solid Films
,
355, 356
, pp.
284
289
.
4.
Johnson, K. L., 1985, Contact Mechanics, Cambridge University Press, Cambridge.
5.
Fischer-Cripps, A. C., 2000, Introduction to Contact Mechanics, Springer, Berlin.
6.
Fischer-Cripps, A. C., 2002, Nanoindentation, Springer, Berlin.
7.
Ting
,
T. C. T.
,
1966
,
J. Appl. Mech.
,
33
, pp.
845
854
.
8.
Sakai
,
M.
, and
Shimizu
,
S.
,
2001
, “
Indentation Rheometry for Glass-Forming Materials
,”
J. Non-Cryst. Solids
,
282
, pp.
236
247
.
9.
Bradshaw
,
R. D.
, and
Brinson
,
L. C.
,
1997
, “
A Sign Control Method for Fitting and Interconverting Material Functions for Linearly Visco-elastic Solids
,”
Mech. Time-Depend. Mater.
,
1
, pp.
85
108
.
10.
Toonder, J. M. J. den, Dijken, A. R. van, Gonda, V., Beijer, J. G. J., Zhang, G. Q., Waeterloos, J., and Ernst, L. J., 2003, “Mechanical Characterization and Modeling of Low-Dielectric-Constant SiLK films Using Nano-Indentation: Time-and Temperature-Effects,” Proc. ECTC2003, pp. 708–713.
11.
Gonda, V., Toonder, J. den, Beijer, J., Zhang, G. Q., and Ernst, L. J., 2003, “Prediction of Thermo-Mechanical Integrity of Wafer Backend Processes,” Proc. EuroSime 2003, L. J. Ernst et al., eds., pp. 359–363.
You do not currently have access to this content.