The need to accurately predict component junction temperatures on fully operational printed circuit boards can lead to complex and time consuming simulations if component details are to be adequately resolved. An analytical approach for characterizing electronic packages is presented, based on the steady-state solution of the Laplace equation for general rectangular geometries, where boundary conditions are uniformly specified over specific regions of the package. The basis of the solution is a general three-dimensional Fourier series solution which satisfies the conduction equation within each layer of the package. The application of boundary conditions at the fluid-solid, package-board and layer-layer interfaces provides a means for obtaining a unique analytical solution for complex IC packages. Comparisons are made with published experimental data for both a plastic quad flat package and a multichip module to demonstrate that an analytical approach can offer an accurate and efficient solution procedure for the thermal characterization of electronic packages. [S1043-7398(00)01403-1]
Skip Nav Destination
Article navigation
September 2000
Technical Papers
Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
J. R. Culham, Associate Professor and Director, Mem. ASME,,
J. R. Culham, Associate Professor and Director, Mem. ASME,
Microelectronics Heat Transfer Laboratory, Department of Mechanical Engineering, University of Waterloo, Waterloo, Canada
Search for other works by this author on:
M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,,
M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,
Microelectronics Heat Transfer Laboratory, Department of Mechanical Engineering, University of Waterloo, Waterloo, Canada
Search for other works by this author on:
T. F. Lemczyk, Project Engineer,
T. F. Lemczyk, Project Engineer,
Louisiana State University, Baton Rouge, LA 70821
Search for other works by this author on:
J. R. Culham, Associate Professor and Director, Mem. ASME,
Microelectronics Heat Transfer Laboratory, Department of Mechanical Engineering, University of Waterloo, Waterloo, Canada
M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,
Microelectronics Heat Transfer Laboratory, Department of Mechanical Engineering, University of Waterloo, Waterloo, Canada
T. F. Lemczyk, Project Engineer,
Louisiana State University, Baton Rouge, LA 70821
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Associate Technical Editor: R. Wirtz.
J. Electron. Packag. Sep 2000, 122(3): 233-239 (7 pages)
Published Online: September 1, 2000
Citation
Culham, J. R., Yovanovich, M. M., and Lemczyk, T. F. (September 1, 2000). "Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution ." ASME. J. Electron. Packag. September 2000; 122(3): 233–239. https://doi.org/10.1115/1.1287928
Download citation file:
Get Email Alerts
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Related Articles
Flexible Profile Compact Thermal Models for Practical Geometries
J. Electron. Packag (September,2007)
On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
J. Electron. Packag (September,2004)
Optimization of Extruded Type External Heat Sink for Multichip Module
J. Electron. Packag (December,1993)
Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
J. Electron. Packag (September,2002)
Related Proceedings Papers
Related Chapters
Introduction
Introduction to Finite Element, Boundary Element, and Meshless Methods: With Applications to Heat Transfer and Fluid Flow
Universal Functions for Nonisothermal and Conjugate Heat Transfer
Applications of Mathematical Heat Transfer and Fluid Flow Models in Engineering and Medicine
Modeling of SAMG Operator Actions in Level 2 PSA (PSAM-0164)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)