Far infrared Fizeau interferometry is developed and it is proposed as a tool for warpage measurement of microelectronics devices. The method provides a whole-field map of surface topography with a basic measurement sensitivity of 5.31 μm per fringe contour. The method is implemented by a compact apparatus using a computer controlled environmental chamber for real-time measurement. The method retains the simplicity of classical interferometry while providing wide applicability to dielectric rough surfaces. Roughness tolerance is achieved by utilizing a far infrared light (λ=10.6 μm). The detailed optical and mechanical configuration is described and selected applications are presented to demonstrate the applicability. The unique advantages of the method are discussed. [S1043-7398(00)01303-7]

Issue Section:
Technical Papers
Keywords:
integrated circuit packaging, integrated circuit testing, flip-chip devices, ball grid arrays, plastic packaging, rough surfaces, light interferometry, surface topography measurement, thermal stresses, environmental testing
Topics:
Interferometry, Surface roughness, Warping, Microelectronic devices
1.
Han, B., Guo, Y., and Choi, H. C., 1993, “Out-of-plane Displacement Measurement of Printed Circuit Board by Shadow Moire´ with Variable Sensitivity,” Proceedings of the 1993 ASME International Electronics Packaging Conference, September, Binghamton.
2.
Yeh
,
C.-P.
,
Ume
,
I. C.
,
Fulton
,
R. E.
,
Wyatt
,
K. W.
, and
Stafford
,
J. W.
,
1993
, “
Correlation of Analytical and Experimental Approaches to Determine Thermally Induced PWB
,”
IEEE Trans. Compon. Hybrids, Manuf. Technol.
,
16
, No.
8
, pp.
986
–
995
.
3.
Guo, Y., 1995, “Applications of Shadow Moire´ Method in Determination of Thermal Deformations in Electronic Packaging,” Proceedings of the 1995 SEM Spring Conference, Grand Rapids, MI.
4.
Stiteler
,
M. R.
,
Ume
,
I. C.
, and
Leutz
,
B.
,
1996
, “
In-process Board Warpage Measurement in a Lab Scale Wave Soldering Oven
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
,
19
, No.
4
, pp.
562
–
569
.
5.
Han, B., and Guo, Y., 1997, “Photomechanics Tools as Applied to Electronic Packaging Product Development,” Experimental/Numerical Mechanics in Electronics Packaging, Han, B., Mahajan, R., and Barker, D., eds., Society for Experimental Mechanics, Bethel, CT, Apr., Vol. 1, pp. 1–14.
6.
Post, D., Han, B., and Ifju, P., 1994, High Sensitivity Moire´: Experimental Analysis for Mechanics and Materials, Springer-Verlag, NY.
7.
Beckmann, P., and Spizzichino, A., 1963, The Scattering of Electromagnetic Wave from Rough Surface, Macmillan, New York.
8.
Munnerlyn
,
C. R.
and
Latta
,
M.
,
1968
, “
Rough Surface Interferometry Using CO2 Laser Source
,”
Appl. Opt.
,
7
, No.
9
, pp.
1858
–
1859
.
9.
Kwon
,
O.
,
1980
, “
Infrared Lateral Shearing Interferometers
,”
Appl. Opt.
19
, No.
8
, pp.
1225
–
1227
.
10.
Kwon
,
O.
,
Wyant
,
J. C.
, and
Hayslett
,
C. R.
,
1980
, “
Rough Surface Interferometry at 10.6 μm
,”
Appl. Opt.
,
19
, No.
11
, pp.
1862
–
1869
.
11.
Lewandowski
,
J.
,
Mongeau
,
B.
,
Cormier
,
M.
, and
Lapierre
,
J.
,
1986
, “
Infrared Interferometers at 10 μm
,”
J. Appl. Phys.
,
60
, No.
10
, pp.
3407
–
3413
.
12.
Lewandowski
,
J.
,
Mongeau
,
B.
,
Cormier
,
M.
, and
Lapierre
,
J.
,
1986
, “
Infrared Holographic Interferometry
,”
Appl. Opt.
,
25
, No.
18
, pp.
3291
–
3296
.
13.
Sinha
,
J.
, and
Tippur
,
H.
,
1998
, “
Infrared Interferometry for Rough Surface Measurements: Application to Failure Characterization and Flaw Detection
,”
Opt. Eng.
,
38
, No.
8
, pp.
2233
–
2239
.
14.
Meyer
,
Y. H.
,
1981
, “
Fringe Shape with an Interferential Wedge
,”
J. Opt. Soc. Am.
,
71
, No.
10
, pp.
1255
–
1263
.
15.
Stover, J. C., 1995, Optical Scattering, SPIE Press, Bellingham, WA.
16.
Verma, K., and Han, B., 2000, “Far Infrared Fizeau Interferometry,” Appl. Opt. (submitted for publication).
17.
Han, B., Park, S.-B., Verma, K., and Ackerman, W., 2000, “On the Design Parameters of Flip-chip PBGA Package Assembly for Optimum Solder Ball Reliability,” IEEE Trans. Compon., Packag., Manuf. Technol., Part A (submitted for publication).
Copyright © 2000
 by ASME
You do not currently have access to this content.