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Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

[+] Author and Article Information
Hsiu-Ping Wei

Mechanical Engineering Department, University of Maryland, University of Maryland, College Park, MD 20742, USA
hpwei@umd.edu

Yu-Hsiang Yang

Mechanical Engineering Department, University of Maryland, University of Maryland, College Park, MD 20742, USA
yhyangv@umd.edu

Bongtae Han

Mechanical Engineering Department, University of Maryland, University of Maryland, College Park, MD 20742, USA
bthan@umd.edu

1Corresponding author.

ASME doi:10.1115/1.4043704 History: Received March 04, 2019; Revised April 25, 2019

Abstract

A comprehensive stochastic model is proposed to predict Package-on-Package (PoP) stacking yield loss. The model takes into account all pad locations at the stacking interface while considering the statistical variations of the warpages and the solder ball heights of both top and bottom packages. The goal is achieved by employing three statistical methods: (1) an advanced approximate integration-based method called eigenvector dimension reduction (EDR) method to conduct uncertainty propagation (UP) analyses, (2) the stress-strength interference (SSI) model to determine the non-contact probability at a single pad, and (3) the union of events considering the statistical dependence to calculate the final yield loss. In this first part, theoretical development of the proposed stochastic model is presented. Implementation of the proposed model is presented in a companion paper.

Copyright (c) 2019 by ASME
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