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Research Papers

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

[+] Author and Article Information
Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun

School of Mechanical Science and Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China

Mingxiang Chen

School of Mechanical Science and Engineering;
State Key Laboratory of Digital Manufacturing
Equipment and Technology,
Huazhong University of Science and Technology,
Wuhan 430074, China
e-mail: chimish@163.com

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received August 21, 2018; final manuscript received April 22, 2019; published online May 24, 2019. Assoc. Editor: Toru Ikeda.

J. Electron. Packag 141(4), 041003 (May 24, 2019) (7 pages) Paper No: EP-18-1070; doi: 10.1115/1.4043645 History: Received August 21, 2018; Revised April 22, 2019

In this work, an easy and low-temperature fabrication method of three-dimensional (3D) ceramic substrate was proposed. A 3DPC ceramic substrate was fabricated by molding alkali-activated aluminosilicate cement (AAAC) to form up a dam (cavity) on direct plated copper (DPC) ceramic substrate at low temperature. The effects of viscosity and curing temperature of cement paste on the properties of the 3DPC were investigated. The prepared 3DPC ceramic substrate achieved precise dimensions and structure, especially the manufacturing accuracy error was less than 2.5%. By optimizing process parameters, the shear strength between dam and DPC substrate reached up to 9.5 MPa. Moreover, thermal cycle and heat resistance tests confirmed that 3DPC exhibits excellent thermal reliability. All experimental results demonstrated that 3DPC ceramic substrate could satisfy with three dimension packaging and integration.

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Figures

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Fig. 1

Process flow for DPC fabrication

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Fig. 2

Process flow for 3DPC by molding the AAAC paste

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Fig. 3

Properties of the AAAC paste: (a) SEM image of drying AAAC paste and (b) size distribution of AAAC paste

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Fig. 4

TGA-DSC curve of AAAC paste in air atmosphere

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Fig. 5

3DPC fabrication precision: ((a)–(c)) Image of DPC and 3DPC of sample A and ((d)–(f)) image of DPC and 3DPC of sample B

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Fig. 6

((a) and (b)) SEM images of dam and ((c) and (d)) EDX spectra of area 1 and area 2

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Fig. 7

(a) Schematic of shear strength measurement and (b) shear strength of 3DPC prepared using AAAC paste with different viscosities

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Fig. 8

Interfacial microstructures of 3DPC at different viscosities

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Fig. 9

Shear strength of 3DPC cured at different temperatures

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Fig. 10

SEM images of bonding interface of 3DPC prepared at different curing temperatures

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Fig. 11

Reliability of 3DPC prepared with 5950CP AAAC paste and cured at 250 °C

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