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Guest Editorial

Guest Editorial - Special Section on InterPACK 2018

[+] Author and Article Information
Ercan Dede

Toyota Research Institute of North America, Ann Arbor, MI 48105
dedeem@umich.edu

Lauren Boteler

U.S. Army Research Laboratory, Adelphi, MD 20783
lauren.m.boteler.civ@mail.mil

Changqing Chen

Huazhong University of Science and Technology, China,Wuhan 430074
cqchen@hust.edu.cn

Przemyslaw Gromala

Robert Bosch GmbH, Germany, Reutlingen 72703
przemyslawjakub.gromala@de.bosch.com

Benjamin Leever

Air Force Research Laboratory, Wright-Patterson Air Force Base, OH 45324
benjamin.leever@us.af.mil

Wei Li

Zhejiang University, China, Zhejiang 310027
weili96@zju.edu.cn

1Corresponding author.

ASME doi:10.1115/1.4043484 History: Received March 26, 2019; Revised April 02, 2019

Abstract

The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Founded in 1992, InterPACK is the flagship conference for the American Society of Mechanical Engineers (ASME) Electronic and Photonic Packaging Division (EPPD). The InterPACK 2018 conference was held in San Francisco, CA, August 27-30.

Section 4: U.S. Gov Employees + Reg Authors
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