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research-article

Interconnect fatigue failure parameter isolation for power device reliability prediction in alternative accelerated mechanical cycling test

[+] Author and Article Information
Mahsa Montazeri

Mechanical Engineering Department, University of Arkansas, Fayetteville, Arkansas- 72701, USA, Phone: +1- (479) 575-3153 Fax: +1-(479) 575-6982
mmontaze@uark.edu

Cody Marbut

Mechanical Engineering Department, University of Arkansas, Fayetteville, Arkansas- 72701, USA, Phone: +1- (479) 575-3153 Fax: +1-(479) 575-6982
cmarbut@uark.edu

David Huitink

Mechanical Engineering Department, University of Arkansas, Fayetteville, Arkansas- 72701, USA, Phone: +1- (479) 575-3153 Fax: +1-(479) 575-6982
dhuitin@uark.edu

1Corresponding author.

ASME doi:10.1115/1.4043480 History: Received October 31, 2018; Revised February 27, 2019

Abstract

In this work, a rapid and low cost accelerated reliability test methodology which was and designed to simulate mechanical stresses induced in flip-chip bonded devices during the thermal cycling reliability test under isothermal conditions is introduced and demonstrated using power device analogous test chips. By stressing these devices in a controlled environment, mechanical stresses become de-coupled from the design and temperature, such that useful lifetimes can be predictable. Mechanical shear stress was cyclically applied directly to device relevant, flip-chip solder interconnects while monitoring for failure. Herein, Finite Element Analysis (FEA) is used to extract various damage metrics of different solder materials, including PbSn37/63, SAC305 and Nano-silver, in both thermal operation and the introduced alternative mechanical testing conditions. Plastic work density and strain are calculated in the critical solder interconnects as factors that indicate the amount of the damage accumulation per cycle during the mechanical cycling, thermal cycling and power cycling tests. The number of cycles to failure for each test were calculated using the fatigue life model developed by Darveaux for eutectic PbSn solder, while for SAC305 Syed's method and for nano-sliver, Knnoerr et al. equations are applied. The effects of environmental temperature and shearing force frequency were studied for the mechanical cycling reliability test, where a modified Norris-Landzberg equation for mechanical cycling test was explored using the simulation results. Finally, comparing the mechanical cycling with the equivalent thermal cycling and power cycling demonstrated a significant reduction in duration of reliability estimation.

Copyright (c) 2019 by ASME
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