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research-article

FEASIBILITY OF PCB-INTEGRATED VIBRATION SENSORS FOR CONDITION MONITORING OF ELECTRONIC SYSTEMS

[+] Author and Article Information
Klas Brinkfeldt

RISE IVF AB, Mölndal, Sweden
klas.brinkfeldt@ri.se

Göran Wetter

RISE IVF AB, Mölndal, Sweden
goran.wetter@ri.se

Andreas Lövberg

RISE IVF AB, Mölndal, Sweden
andreas.lovberg@ri.se

Per-Erik Tegehall

RISE IVF AB, Mölndal, Sweden
per-erik.tegehall@ri.se

Dag Andersson

RISE IVF AB, Mölndal, Sweden
dag.andersson@ri.se

Jan Strandberg

RISE Acreo AB, Norrköping, Sweden
jan.strandberg@ri.se

Johnny Goncalves

NOTE Norrtelje AB, Norrtälje, Sweden
Johnny.Goncalves@note.eu

Jonas Söderlund

NOTE Norrtelje AB, Norrtälje, Sweden
jonas.soderlund@note.eu

Mikael Kwarnmark

Cogra Pro AB, Älvängen, Sweden
mikael@cograpro.se

1Corresponding author.

ASME doi:10.1115/1.4043479 History: Received October 31, 2018; Revised March 20, 2019

Abstract

The increasing complexity of electronics in systems used in safety critical applications, such as for example self-driving vehicles requires new methods to assure the hardware reliability of the electronic assemblies. Prognostics and Health Management (PHM) that uses a combination of data-driven and Physics-of-Failure models is a promising approach to avoid unexpected failures in the field. In this work, the feasibility to manufacture and use integrated sensors in the inner layers of a printed circuit board (PCB) as mission load indicators measuring impacts and vibrations has been investigated. A four-layered PCB was designed in which piezoelectric sensors were printed on one of the laminate layers before the lamination process. Manufacturing of the PCB was followed by the assembly of components in a standard production reflow soldering process. Tests to ensure that the functionality of the sensor material was unaffected by the soldering process were performed. Results showed a yield of approximately 30 % of the sensors after the reflow soldering process. Optimization of the sensor design and placement is expected to bring the yield to 50 % or better. The sensors responded as expected to impact tests. Delamination areas, which does not seem to be due to the presence of embedded sensors alone but rather the result of a combination of several factors, were present in the test PCBs. The conclusion of this work is that it is feasible to embed piezoelectric sensors in the layers of a PCB.

Copyright (c) 2019 by ASME
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