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Review Article

A State-of-the-art Review of Fatigue Life Prediction Models for Solder Joint

[+] Author and Article Information
Sinan Su

Department of Industrial and Systems Engineering, Auburn University, 3301 Shelby Center, Auburn, AL 36849
szs0099@auburn.edu

Francy Akkara

Department of Industrial and Systems Engineering, Auburn University, 3301 Shelby Center, Auburn, AL 36849
fzj0004@auburn.edu

Ravinder Thaper

Department of Industrial and Systems Engineering, Auburn University, 3301 Shelby Center, Auburn, AL 36849
rkt0005@auburn.edu

Atif Alkhazali

Department of Industrial Engineering, the Hashemite University, Jordan
Atif@hu.edu.jo

Mohammad Hamasha

Department of Industrial Engineering, the Hashemite University, Jordan
mhamasha@hu.edu.jo

Sa'd Hamasha

Department of Industrial and Systems Engineering, Auburn University, 3301 Shelby Center, Auburn, AL 36849
smh0083@auburn.edu

1Corresponding author.

ASME doi:10.1115/1.4043405 History: Received December 18, 2018; Revised March 27, 2019

Abstract

Fatigue failure of solder joints is one of the major cause of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods were used to model the fatigue mechanism of solder joints. In this article, the majority fatigue life models are summarized, with emphasis on the latest developments in the fatigue life prediction methods. All the models reviewed are grouped into four categories based on the factors affecting the fatigue life of solder joints, which are: plastic strain based fatigue models, creep damage based fatigue models, energy based fatigue models, and damage accumulation based fatigue models. The models that do not fit any of the above categories, are grouped into "other models." Applications and potential limitations for those models are also discussed.

Copyright (c) 2019 by ASME
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