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Review Article

Liquid Cooling of Compute System

[+] Author and Article Information
Jessica Gullbrand

Intel Corporation, Data Center Engineering & Architecture Group, 2111 NE 25th Avenue, Hillsboro, OR 97124
jessica.gullbrand@intel.com

Mark J Luckeroth

Intel Corporation, Data Center Engineering & Architecture Group, 2111 NE 25th Avenue, Hillsboro, OR 97124
mark.j.luckeroth@intel.com

Mark E Sprenger

Intel Corporation, Data Center Engineering & Architecture Group, 2111 NE 25th Avenue, Hillsboro, OR 97124
mark.e.sprenger@intel.com

Casey Winkel

Intel Corporation, Data Center Engineering & Architecture Group, 2111 NE 25th Avenue, Hillsboro, OR 97124
casey.winkel@intel.com

1Corresponding author.

ASME doi:10.1115/1.4042802 History: Received July 05, 2018; Revised November 16, 2018

Abstract

The continued demand for increasing compute performance result in an increasing system power and power density of many computers. The increased power requires more efficient cooling solutions than traditionally used air cooling. Therefore, liquid cooling, which has traditionally been used for large data center deployments, is becoming more mainstream. Liquid cooling can be used selectively to cool the high power components, or the whole compute system. In this paper, the example of a fully liquid cooled server is used to describe the different ingredients needed, together with the design challenges associated with them. The liquid cooling ingredients are: cooling distribution unit (CDU), fluid, manifold, quick disconnects, and cold plates. Intel is driving an initiative to accelerate liquid cooling implementation and deployment by enabling the ingredients above. The functionality of these ingredients are discussed in this paper, while cold plates are discussed in detail.

Copyright (c) 2019 by ASME
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