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Special Section Articles

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

[+] Author and Article Information
Aastha Uppal, Weihua Tang

Intel Corporation,
5000 W. Chandler Boulevard, CH5-157,
Chandler, AZ 85226

Jerrod Peterson, Xi Guo

Intel Corporation,
5200 NE Elam Young Pkwy, HF3,
Hillsboro, OR 97124

Je-Young Chang

Intel Corporation,
5000 W. Chandler Boulevard, CH5-157,
Chandler, AZ 85226
e-mail: je-young.chang@intel.com

Frank Liang

Intel Corporation,
5200 NE Elam Young Pkwy, HF2,
Hillsboro, OR 97124

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 2, 2018; final manuscript received December 7, 2018; published online March 4, 2019. Assoc. Editor: Jin Yang.

J. Electron. Packag 141(1), 010803 (Mar 04, 2019) (8 pages) Paper No: EP-18-1053; doi: 10.1115/1.4042801 History: Received July 02, 2018; Revised December 07, 2018

The demands for both thinner bare-die ball grid array (BGA) packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with system on chip packages in mobile personal computer (PC) platforms. The thermomechanical interactions between the bare-die package and the thermal solution are very critical, creating the needs for: (1) an in-depth thermomechanical characterization to understand their impacts on product quality and performance and (2) a simple and yet robust modeling methodology to analyze design parameters using a commercially available software. In this paper, experimental metrologies and modeling methodology are developed with the details of contents documented. Validation of the newly developed tools and recommendation/guidance are also discussed for detailed assessments of thermomechanical tradeoffs for optimal design spaces for next-generation mobile platforms.

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Figures

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Fig. 1

(a) Representative thermal solution design for mobile PC platform and (b) schematic of package and thermal solution shapes post assembly (not to scale) [13]

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Fig. 2

Flowchart of the approach. Experimental metrologies are developed to characterize the underlying thermo-mechanical interactions. The experimental data are used to inform and correlate the modeling methodology, which guides design.

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Fig. 3

Schematic showing temperature gradient method to measure θTIM based on ASTM D5470 standard [14]

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Fig. 4

Contact properties for TIM model from ASTM TIM tester data

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Fig. 5

(a) Schematic of the loading fixture with a sapphire window that allows optical access to the dice at use conditions and (b) die warpage measurement results of an MCP under thermomechanical loads [13]

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Fig. 6

Schematic of MTAT setup

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Fig. 7

Variations of θj-HP and die pressure distribution with enabling loads using two different thermal grease TIMs—example data

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Fig. 8

Multichip package model, where dies 1 and 2 have curved top surfaces: (a) model components and (b) thermal loads on the active (bottom) surfaces of the dice

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Fig. 9

Heat pipe model detail

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Fig. 10

Screw preload applied to fasteners generates TIM load

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Fig. 11

Pressure contour comparisons for: (a) model at spring gap of 1.06 mm, (b) test data at spring gap of 1.06 mm, (c) model at spring gap of 0.44 mm, and (d) test data at spring gap of 0.44 mm

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Fig. 12

Comparison of model predictions to test data for load, peak local pressure, and thermal resistance

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Fig. 13

Effect of cold plate thickness reduction on total package load and thermal resistance, over a range of load conditions

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