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Research Papers

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

[+] Author and Article Information
Guicui Fu

School of Reliability and Systems Engineering,
Beihang University,
WeiMin Building 440,
No. 37 XuanYuan Road,
Beijing 100191, China
e-mail: fuguicui@buaa.edu.cn

Maogong Jiang

School of Reliability and Systems Engineering,
Beihang University,
WeiMin Building 429,
No. 37 XuanYuan Road,
Beijing 100191, China
e-mail: maogong@buaa.edu.cn

Bo Wan

School of Reliability and Systems Engineering,
Beihang University,
WeiMin Building 434,
No. 37 XuanYuan Road,
Beijing 100191, China
e-mail: wanbo@buaa.edu.cn

Yanruoyue Li

School of Energy and Power Engineering,
Beihang University,
WeiMin Building 429,
No. 37 XuanYuan Road,
Beijing 100191, China
e-mail: 15652928449@163.com

Cheng Ma

China Aeronautical Radio Electronics
Research Institute,
No. 432 Ziyue Road,
Minhang District,
Shanghai 200241, China
e-mail: machengrms@buaa.edu.cn

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 8, 2018; final manuscript received October 7, 2018; published online February 25, 2019. Assoc. Editor: Yi-Shao Lai.

J. Electron. Packag 141(1), 011004 (Feb 25, 2019) (10 pages) Paper No: EP-18-1055; doi: 10.1115/1.4041984 History: Received July 08, 2018; Revised October 07, 2018

Long bonding wires may swing significantly and touch with adjacent ones, which will result in short circuit under mechanical condition, especially in aerospace applications. This may seriously affect the operational reliability of high-density hermetic package components. The aim of this paper is to assess the touch risk of high-density package component under mechanical shock condition. An experiment setup, which can obtain the touch critical load and detect the wires swing touch through voltage signal captured by oscilloscope, is designed and built. To obtain the vibration data of different bonding wire structures under different shock loads, numerical simulation models are established after verified by the experimental data. Additionally, initial swing amplitude model, vibration frequency model, and damped coefficient model are established based on the simulation and experiment data. Furthermore, wire swing touch risk assessment model is established in consideration of the distribution of wire structure and shock load deviation. Based on the verified numerical simulation model, vibration characteristic parameters, including the initial swing amplitude, vibration frequency, and damped coefficient, can be calculated by numerical simulation and experimental results. The proposed method can be used to assess bonding wire touch risk in high-density hermetic package quantitatively. Potential touch risk, which cannot be reflected by failure analysis of structure damage after test, can also be detected by the electronic measurement designed in this paper. The proposed method can effectively reflect short circuit between long bonding wires of hermetic package in large shock applications, such as transport and launch.

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References

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Figures

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Fig. 1

Typical structure of high-density hermetic package IC

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Fig. 2

An outline of the wire swing touch detector

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Fig. 3

Proposed experimental setup: (1) DC power supply, (2) computer to acquire signal, (3) computer to control tester, (4) oscilloscope, (5) mechanical shock tester, and (6) bonding wire sample and fixture

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Fig. 4

Mechanical shock load profiles used in test and simulation

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Fig. 5

Typical structure and the structure parameters of Q-loop bonding wire [15]: (a) a schematic drawing of Q-auto-loop wire bond and (b) vertical view of 1/4 chip and 1/8 bonding wires group

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Fig. 6

Basic electrical signal measurement circuit

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Fig. 7

Structure of designed testing sample: (a) overall layout of testing sample, (b) detailed connections and pads of testing sample, and (c) testing fixture and testing sample

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Fig. 8

Ideal voltage waveform of bonding wire swing touch

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Fig. 9

Finite element model of Q-loop bonding wire

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Fig. 10

Bonding wire swing deformation simulation results

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Fig. 11

Testing and simulation results

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Fig. 12

Numerical results of initial swing amplitude Aini affected by different parameters: (a) relationship between Aini and H (D = 25 μm, F = 1500 g), (b) relationship between Aini and D (H = 0.25 mm, F = 1500 g), and (c) relationship between Aini and F (D = 25 μm, H = 0.25 mm)

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Fig. 13

Numerical results of vibration frequency ωn affected by bonding wire diameter D: (a) relationship between ωn and H (D = 25 μm) and (b) relationship between ωn and D (H = 0.25 mm)

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Fig. 14

Proposed procedure to calculate the bonding wire swing touch criteria distance

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Fig. 15

Vibration waveforms of adjacent bonding wires

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Fig. 16

Distance between adjacent wires

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Fig. 17

Proposed procedure to calculate the bonding wire swing risk

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Fig. 18

The probability density distribution of bonding wires distance

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Fig. 19

The probability distribution of bonding wires distance

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Fig. 20

Deformation of bonding wires captured by high-speed camera under mechanical shock

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Fig. 21

The voltage signal captured by the oscilloscope

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