Research Papers

Double-Layer Microchannel Heat Sinks With Transverse-Flow Configurations

[+] Author and Article Information
Danish Ansari

Department of Mechanical Engineering,
Graduate School of Inha University,
Incheon 402-751, South Korea
e-mail: danishansari@live.in

Kwang-Yong Kim

Fellow ASME
Department of Mechanical Engineering,
Inha University,
Incheon 402-751, South Korea
e-mail: kykim@inha.ac.kr

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received February 24, 2016; final manuscript received May 1, 2016; published online May 19, 2016. Assoc. Editor: Xiaobing Luo.

J. Electron. Packag 138(3), 031005 (May 19, 2016) (13 pages) Paper No: EP-16-1041; doi: 10.1115/1.4033558 History: Received February 24, 2016; Revised May 01, 2016

The performances of various transverse-flow double-layer microchannel heat sink configurations were evaluated compared to those of parallel-flow heat sink configurations via conjugate heat transfer analysis. For the analysis, three-dimensional Navier–Stokes and energy equations for steady incompressible laminar flow were solved using a finite-volume solver. Water with temperature-dependent thermophysical properties was used as a coolant. The thermal resistances were evaluated for various flow configurations of both cross-channel and parallel-channel designs with identical geometric parameters and total flow rate. Changes in the microchannel flow direction lead to remarkable changes in thermal resistance and temperature uniformity. A transverse-flow configuration exhibited the best overall performance among the tested flow configurations in terms of the thermal resistance, temperature uniformity, and pressure drop.

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Fig. 2

Flow configurations: (a) A-TF, (b) B-TF, (c) C-TF, (d) D-TF, (e) E-TF, (f) F-PF, (g) G-CF, and (h) H-CF

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Fig. 1

Schematic diagram of heat sink designs: (a) cross-channel design, (b) parallel-channel design, and (c) design parameters

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Fig. 3

Grid independence test

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Fig. 4

Validation of numerical results compared with experimental data for an average temperature at the base of the solid along the center line in the direction of flow

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Fig. 5

Variations in thermal resistance with the total flow rate

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Fig. 6

Thermal resistance values of different flow configurations at different total flow rates: (a) 0.002 kg/s, (b) 0.006 kg/s, and (c) 0.010 kg/s

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Fig. 7

Temperature contours for different flow configurations on the x–z plane at y/Ly = 0 (base of the heat sink) and y/Ly = 0.5 (middle height of the heat sink) for a total flow rate of 0.008 kg/s: (a) A-TF, (b) B-TF, (c) C-TF, (d) D-TF, (e) E-TF, (f) F-PF, (g) G-CF, and (h) H-CF

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Fig. 8

Temperature contours on the y–z plane at x/Lx = 0.225, 0.475, 0.725, and 0.975: (a) D-TF (transverse-flow), (b) F-PF (parallel-flow), (c) G-CF (counter-flow) at a total flow rate of 0.008 kg/s, and (d) locations of the contour planes

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Fig. 9

Temperature distributions in the z direction in the middle between two channel layers (y/Ly = 0.5) at x/Lx = 0.225, 0.475, 0.725, and 0.975 for a total flow rate of 0.008 kg/s: (a) D-TF (transverse-flow), (b) F-PF (parallel-flow), and (c) G-CF (counter-flow)

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Fig. 10

Variations in total pressure drop with the total flow rate

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Fig. 11

Total pressure drop of different flow configurations at different flow rates: (a) 0.002 kg/s, (b) 0.006 kg/s, and (c) 0.010 kg/s



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