Research Papers

Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling

[+] Author and Article Information
Sandesh S. Chougule

Discipline of Mechanical Engineering,
Indian Institute of Technology Indore,
Indore 453446, Madhya Pradesh, India
e-mail: sandesh_chougule@yahoo.com

S. K. Sahu

Assistant Professor
Discipline of Mechanical Engineering,
Indian Institute of Technology Indore
Indore 453446, Madhya Pradesh, India
e-mail: santosh.sahu04@@gmail.com

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received February 22, 2014; final manuscript received October 31, 2014; published online December 3, 2014. Assoc. Editor: Siddharth Bhopte.

J. Electron. Packag 137(2), 021004 (Jun 01, 2015) (7 pages) Paper No: EP-14-1024; doi: 10.1115/1.4028994 History: Received February 22, 2014; Revised October 31, 2014; Online December 03, 2014

The paper reports the thermal performance of a nanofluid (MCNT/water) charged heat pipe with phase change material (PCM) as energy storage material (ESM) for electronic cooling. The adiabatic section of heat pipe is covered by the PCM stored in a container made of acrylic material. Here, paraffin is used as PCM. PCM can absorb and release thermal energy depending upon the fluctuations in the heating load. Tests are conducted to obtain the temperature distributions in PCM during charge/discharge processes. Present study utilizes two different ESM (water and paraffin), different fan speeds and heating powers in the PCM cooling module. The cooling module with heat pipe and paraffin as ESM found to save higher fan power consumption compared to the cooling module that utilities only a heat pipe.

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Kim, K. S., Won, M. H., Kim, J. W., and Back, B. J., 2003, “Heat Pipe Cooling Technology for Desktop PC CPU,” Appl. Therm. Eng., 23(9), pp. 1137–1144. [CrossRef]
Chang, Y. W., Cheng, C. H., Wang, J. C., and Chen, S. L., 2008, “Heat Pipe for Cooling of Electronic Equipment,” Energy Convers. Manage., 49(11), pp. 3398–3404. [CrossRef]
Wang, J., 2011, “L-Type Heat Pipes Application in Electronic Cooling System,” Int. J. Therm. Sci., 50(1), pp. 97–105. [CrossRef]
Take, K., and Webb, R. L., 2001, “Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader,” ASME J. Electron. Packag., 123(3), pp. 189–195. [CrossRef]
Lu, M., and Mok, L., 2006, “A Graphite Foams Based Vapor Chamber for Chip Heat Spreading,” ASME J. Electron. Packag., 128(4), pp. 427–431. [CrossRef]
Yu, X., Zhang, L., Zhou, E., and Feng, Q., 2011, “Heat Transfer of an IGBT Module Integrated With a Vapor Chamber,” ASME J. Electron. Packag., 133(1), p. 011008. [CrossRef]
Choi, J., Jeong, M., Yoo, J., and Seo, M., 2012, “A New CPU Cooler Design Based on an Active Cooling Heat Sink Combined With Heat Pipes,” Appl. Therm. Eng., 44, pp. 50–66. [CrossRef]
Choi, S. U. S., 1995, “Enhancing Thermal Conductivity of Fluids With Nanoparticles,” Developments and Applications of Non-Newtonian Flows, FED-vol. 231/MD-vol. 66, D. A.Siginer, H. P.Wang, eds., American Society of Mechanical Engineers, New York, pp. 99–105.
Liu, Z. H., Yang, X. F., and Guo, G. L., 2007, “Effect of Nanoparticles in Nanofluid on Thermal Performance in a Miniature Thermosyphon,” J. Appl. Phys., 102(1), p. 013526. [CrossRef]
Liu, Z. H., Yang, X. F., and Guo, G. L., 2010, “Influence of Carbon Nanotubes Suspension on the Thermal Performance of a Miniature Thermosyphon,” Int. J. Heat Mass Transfer, 53(9–10), pp. 1914–1920. [CrossRef]
Naphon, P., Assadamongkol, P., and Borirak, T., 2008, “Experimental Investigation of Titanium Nanofluids on the Heat Pipe Thermal Efficiency,” Int. Commun. Heat Mass Transfer, 35(10), pp. 1316–1319. [CrossRef]
Gabriela, H., Angel, H., Ion, M., and Florian, D., 2011, “Experimental Study of the Thermal Performance of Thermosyphon Heat Pipe Using Iron Oxide Nanoparticles,” Int. J. Heat Mass Transfer, 54(1–3), pp. 656–661. [CrossRef]
Noie, S. H., Zeinali Heris, S., Kahani, M., and Nowee, S. M., 2009, “Heat Transfer Enhancement Using Al2O3/Water Nanofluid in a Two-Phase Closed Thermosyphon,” Int. J. Heat Fluid Flow, 30(4), pp. 700–705. [CrossRef]
Putra, N., Yanuar, and Iskandar, F. N., 2011, “Application of Nanofluids to a Heat Pipe Liquid-Block and the Thermoelectric Cooling of Electronic Equipment,” Exp. Therm. Fluid Sci., 35(7), pp. 1274–1281. [CrossRef]
Yousefi, T., Mousavi, S. A., Farahbakhsh, B., and Saghir, M. Z., 2013, “Experimental Investigation on the Performance of CPU Coolers: Effect of Heat Pipe Inclination Angle and the Use of Nanofluids,” Microelectron. Reliab., 53(12), pp. 1954–1961. [CrossRef]
Jahani, K., Mohammadi, M., Shafii, M. B., and Shiee, Z., 2013, “Promising Technology for Electronic Cooling Nanofluidic Micro Pulsating Heat Pipes,” ASME J. Electron. Packag., 135(2), p. 021005. [CrossRef]
Chougule, S. S., Pise, A. T., and Madane, P. A., 2012, “Performance of Nanofluid-Charged Solar Water Heater by Solar Tracking System,” International Conference on Advances in Engineering, Science and Management (ICAESM), Nagapattiam, India, Mar. 30–31, pp. 247–254.
Pise, A. T., and Chougule, S. S., 2011, “Experimental Investigation Heat Transfer Augmentation of Solar Heat Pipe Collector by Using Nanofluid,” 21st National and 10th ISHMT-ASME Heat and Mass Transfer Conference, Chennai, India, Dec. 27–30, Paper No. ISHMT_IND_05_011.
Chougule, S. S., Sahu, S. K., and Pise, A. T., 2014, “Thermal Performance of Two Phase Thermosyphon Flat-Plate Solar Collectors by Using Nanofluid,” ASME J. Sol. Energy, 136(1), p. 014503. [CrossRef]
Chougule, S. S., Sahu, S. K., and Pise, A. T., 2013, “Performance Enhancement of Two Phase Thermosyphon Flat-Plate Solar Collectors by Using Surfactant and Nanofluid,” Front. Heat Pipes, 4(1), p. 013002. [CrossRef]
Chougule, S. S., and Sahu, S. K., 2014, “Comparative Study of Cooling Performance of Automobile Radiator Using Al2O3/Water and CNT/Water Nanofluid,” ASME J. Nanotech. Eng. Med., 5(1), p. 011001. [CrossRef]
Chougule, S. S., and Sahu, S. K., 2014, “Thermal Performance of Automobile Radiator Using Carbon Nanotube-Water Nanofluid—Experimental Study,” ASME J. Therm. Sci. Eng. Appl., 6(4), p. 041009. [CrossRef]
Chougule, S. S., and Sahu, S. K., 2013, “Comparison of Augmented Thermal Performance of CNT/Water and Al2O3/Water Nanofluids in Laminar Flow Through a Straight Circular Duct Fitted With Helical Screw Tape Inserts,” ASME J. Nanotechnol. Eng. Med., 4(4), p. 040904. [CrossRef]
Chougule, S. S., and Sahu, S. K., “Comparative Study on Heat Transfer Enhancement of Low Volume Concentration of Al2O3–Water and CNT–Water Nanofluids in Transition Regime Using Helical Screw Tape Inserts,” Exp. Heat Transfer (accepted). [CrossRef]
Chougule, S. S., and Sahu, S. K., 2015, “Performance of Wickless Heat Pipe Flat Plate Solar Collectors Having Different Filling Ratios,” ASME J. Sol. Energy, 137(2), p. 024501. [CrossRef]
Chougule, S. S., and Sahu, S. K., 2013, “Model of Heat Conduction in Hybrid Nanofluid,” International Conference on Emerging Trends in Computing, Communication and Nanotechnology (ICE-CCN 2013), Tirunelveli, India, Mar. 25–26, pp. 337–341. [CrossRef]
Chougule, S. S., and Sahu, S. K., 2013, “Experimental Investigation of Heat Transfer Augmentation in Automobile Radiator With CNT/Water Nanofluid,” ASME Paper No. MNHMT2013-22100. [CrossRef]
Chougule, S. S., and Sahu, S. K., 2013, “Comparison of Augmented Thermal Performance of CNT/Water and Al2O3/Water Nanofluids in Transition Flow Through a Straight Circular Duct Fitted With Helical Screw Tape Inserts,” 22nd National and 11th ISHMT-ASME Heat and Mass Transfer Conference, IIT Kharagpur, India, Dec. 28–31, Paper No. HMTC1300811.
Chougule, S. S., and Sahu, S. K., 2014, “An Integrated Effect of PCM and Nanofluid Charged Heat Pipe for Electronics Cooling,” ASME 12th International Conference on Nanochannels, Microchannels, and Minichannels, Chicago, IL, Aug. 13–17, Paper No. FEDSM2014-21769.
Chougule, S. S., Pise, A. T., and Pardeshi, P. S., 2012, “Studies of CNT-Nanofluid in Two Phase System,” Int. J. Global Technology Initiatives, 1(1), pp. F14–F20.
Cao, Y., Gao, M., Beam, J. E., 1997, “Experiments and Analyses of Flat Miniature Heat Pipes,” J. Thermophys. Heat Transfer, 11(2), pp. 158–164. [CrossRef]
Hopkins, R., Faghri, A., and Khrustalev, D., 1999, “Flat Miniature Heat Pipes With Micro Capillary Grooves,” ASME J. Heat Transfer, 121(1), pp. 102–109. [CrossRef]
Weng, Y. C., Cho, H. P., Chang, C. C., and Chen, S. L., 2011, “Heat Pipe With PCM for Electronic Cooling,” Appl. Energy, 88(5), pp. 1825–1833. [CrossRef]
Kreith, F., and Bohn, M. S., 2001, Principles of Heat Transfer, Cengage Learning Inc., Stamford, CT.
O'Neill, P. S., Gottzman, C. F., and Terbot, J. W., 1972, “Novel Heat Exchanger Increases Cascade Cycle Efficiency for Natural Gas Liquefaction,” Advances in Cryogenic Engineering, K. D.Timmerhaus, ed., Plenum, New York, pp. 420–437.
Rieger, H., Projahn, U., and Beer, H., 1982, “Analysis of the Heat Transport Mechanisms During Melting Around a Horizontal Circular Cylinder,” Int. J. Heat Mass Transfer, 25(1), pp. 137–147. [CrossRef]
Chiang, Y. C., 2005, “Study and Application of the Micro Structure Vapor Chamber,” Ph.D. thesis, National Taiwan University, Taipei City, Taiwan.


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Fig. 1

(a) SEM image at magnification of 20,000× of MWCNT particles and (b) photograph of functionalized MCNT–water nanofluid

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Fig. 2

(a) Schematic diagram of heat pipe cooling module test facility and thermocouple location. (b) Photograph of heat pipe cooling module.

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Fig. 3

Temperature growth in charge process for different ESM (a) water, (b) PCM (paraffin), and (c) without ESM

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Fig. 4

Comparison between efficiency curves at different cooling mass flow rate

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Fig. 5

Temperature growth in different ESM for simultaneous charge and discharge process for different heating power: (a) 10 W and (b) 30 W

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Fig. 6

Schematic of thermal resistance–capacitor model for the heat pipe-PCM module

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Fig. 7

Comparison of experimental and simulation values of temperature growth in PCM in charge process



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