Research Papers

A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions

[+] Author and Article Information
Bo Tao

e-mail: taobo@mail.hust.edu.cn

Zhouping Yin

e-mail: yinzhp@mail.hust.edu.cn

Youlun Xiong

State Key Laboratory of Digital
Manufacturing Equipment and Technology,
Huazhong University of Science and Technology,
Wuhan, Hubei 430074, China

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 27, 2012; final manuscript received September 25, 2013; published online November 12, 2013. Assoc. Editor: Seungbae Park.

J. Electron. Packag 135(4), 041008 (Nov 12, 2013) (7 pages) Paper No: EP-12-1112; doi: 10.1115/1.4025840 History: Received December 27, 2012; Revised September 25, 2013

Hygrothermal environments can degrade anisotropic conductive adhesive (ACA) joints by weakening the shear strength of adhesive interface. In this paper, the shear strength degradation model of ACA joints under hygrothermal conditions was formulated through experimental testing and theoretical modeling. The shear strength degradation data were obtained from different hygrothermal aging tests and the ACA moisture properties were characterized for the corresponding hygrothermal conditions. Theoretical models considering the hygrothermal factors of T (temperature), RH (relative humidity), and t (time), were used to fit the shear strength degradation data. It was found that the inverse exponential law was the best candidate model to predict the degradation data. The shear strength degradation model of ACA joints under hygrothermal conditions was proposed, where the relationship of the S (shear strength) and the hygrothermal factors (T, RH, and t) was expressed in an analytical model. The degradation model was validated by experiments, and the model predictions agreed well with the test results.

Copyright © 2013 by ASME
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Wong, C. P., and Lu, D., 2000, “Recent Advances in Electrically Conductive Adhesives for Electronics Applications,” Proceedings of 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18–21, pp. 121–128. [CrossRef]
Yim, M. J., and Paik, K. W., 2006, “Recent Advances on Anisotropic Conductive Adhesives (ACAs) for Flat Panel Displays and Semiconductor Packaging Applications,” Int. J. Adhes. Adhes., 26(5), pp. 304–313. [CrossRef]
Li, Y., and Wong, C. P., 2006, “Recent Advances of Conductive Adhesives as a Lead-Free Alternative in Electronic Packaging: Materials, Processing, Reliability, and Applications,” Mater. Sci. Eng. R, 51(1–3), pp. 1–35. [CrossRef]
Rongwei, Z., Agar, J. C., and Wong, C. P., 2010, “Recent Advances on Electrically Conductive Adhesives,” 12th Electronics Packaging Technology Conference (EPTC), Singapore, December 8–10, pp. 696–704. [CrossRef]
Liu, J., 2001, “ACA Bonding Technology for Low Cost Electronics Packaging Applications—Current Status and Remaining Challenges,” Soldering Surf. Mount Technol., 13(3), pp. 39–57. [CrossRef]
Lin, Y. C., and Zhong, J., 2008, “A Review of the Influencing Factors on Anisotropic Conductive Adhesives Joining Technology in Electrical Applications,” J. Mater. Sci., 43(9), pp. 3072–3093. [CrossRef]
Lin, Y. C., Chen, X., and Wang, Z. P., 2006, “Effects of Hygrothermal Aging on Anisotropic Conductive Adhesive Joints: Experiments and Theoretical Analysis,” J. Adhes. Sci. Technol., 20(12), pp. 1383–1399. [CrossRef]
Lin, Y. C., Chen, X., Zhang, H. J., and Wang, Z. P., 2006, “Effects of Hygrothermal Aging on Epoxy-Based Anisotropic Conductive Film,” Mater. Lett., 60(24), pp. 2958–2963. [CrossRef]
Saarinen, K., and Heino, P., 2010, “Moisture Effects on Adhesion of Non-Conductive Adhesive Attachments,” Soldering Surf. Mount Technol., 22(1), pp. 41–46. [CrossRef]
Saarinen, K., and Frisk, L., 2011, “Changes in Adhesion of Non-Conductive Adhesive Attachments During Humidity Test,” IEEE Trans. Compon., Packag., Manuf. Technol., Part C, 1(7), pp. 1082–1088. [CrossRef]
JEDEC, 2008, “Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices,” JEDEC Standard JESD22-A120A, JEDEC, Arlington, VA.
Fan, X. J., Lee, S., and Han, Q., 2009, “Experimental Investigations and Model Study of Moisture Behaviors in Polymeric Materials,” Microelectron. Reliab., 49(8), pp. 861–871. [CrossRef]
Yoon, J. Y., Kim, I., and Lee, S. B., 2009, “Measurement and Characterization of the Moisture-Induced Properties of ACF Package,” ASME J. Electron. Packag., 131, p. 021012. [CrossRef]
Schuller, S., Schilinsky, P., Hauch, J., and Brabec, C. J., 2004, “Determination of the Degradation Constant of Bulk Heterojunction Solar Cells by Accelerated Lifetime Measurements,” Appl. Phys. A, 79(1), pp. 37–40. [CrossRef]
Wang, F. K., and Chu, T. P., 2012, “Lifetime Predictions of LED-Based Light Bars by Accelerated Degradation Test,” Microelectron. Reliab., 52(7), pp. 1332–1336. [CrossRef]
Datla, N. V., Ameli, A., Papini, M., and Spelt, J. K., 2012, “Effects of Hygrothermal Aging on the Fatigue Behavior of Two Toughened Epoxy Adhesives,” Eng. Fract. Mech., 79(1), pp. 61–77. [CrossRef]
Ameli, A., Papini, M., and Spelt, J. K., 2011, “Hygrothermal Degradation of Two Rubber-Toughened Epoxy Adhesives: Application of Open-Faced Fracture Tests,” Int. J. Adhes. Adhes., 31(1), pp. 9–19. [CrossRef]
Wylde, J. W., and Spelt, J. K., 1998, “Measurement of Adhesive Joint Fracture Properties as a Function of Environmental Degradation,” Int. J. Adhes. Adhes., 18(4), pp. 237–246. [CrossRef]
Jiang, Z., Lahoti, S. P., Sitlani, M. P., Kallolimath, S. C., and Putta, R., 2005, “Investigation of Non-Uniform Moisture Distribution on Determination of Hygroscopic Swelling Coefficient and Finite Element Modeling for a Flip Chip Package,” Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005), Berlin, Germany, April 18–20, pp.112–119. [CrossRef]


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Fig. 1

Methodology for degradation model establishment

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Fig. 2

(a) Schematic of the ACA joint sample, (b) measurement principle, and (c) plot of maximum shear force

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Fig. 3

Test data and Fick's fitting curves

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Fig. 4

ln(D) versus 1/T curve of ACA

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Fig. 5

ln(Csat) versus 1/T curve of ACA

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Fig. 6

Inverse exponential law fitting

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Fig. 7

Plot of the experimental result and model prediction

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Fig. 8

Two-dimension moisture diffusion



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