Research Papers

Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics

[+] Author and Article Information
R. A. Wirtz1

Mechanical Engineering Department,  University of Nevada, Reno, NV 89557rawirtz@unr.edu

K. Swanson, M. Yaquinto

Mechanical Engineering Department,  University of Nevada, Reno, NV 89557


Corresponding author.

J. Electron. Packag 134(1), 011002 (Mar 19, 2012) (8 pages) doi:10.1115/1.4005915 History: Received August 10, 2010; Revised November 03, 2011; Accepted November 30, 2011; Published March 07, 2012; Online March 19, 2012

An important design objective that is unique to hand-held units is the need to constrain two temperatures: the maximum temperature of the electronic components and the maximum skin temperature of the hand-held unit. The present work identifies and evaluates, through parametric modeling and experiments, the passive thermal energy storage volume characteristics and phase change material composite properties that are most suitable for thermal control of small form-factor, high power-density, hand-held electronics. A one-dimensional transient analytical model, based on an integral heat balance, is formulated and benchmarked. The model accurately simulates the heat storage/recovery process in a semi-infinite, “dry” phase change material slab. Dimensional analysis identifies the time and temperature metrics and nondimensional parameters that describe the heat storage/release process. Parametric analysis illustrates how changes in these nondimensional parameters affect thermal energy storage volume thermal response.

Copyright © 2012 by American Society of Mechanical Engineers
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TES-volume test cell

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Test article thermal response: Heat flux

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Figure 13

Test article thermal response: Temperature

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Figure 3

Benchmark PCMC-pad thermal response

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Benchmark PCMC-pad temperature profiles

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Benchmark PCMC-pad temperature profile slopes

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Thermal response of PCMC pad with mushy region

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Benchmark PCMC-pad thermal response: Partial melt

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Benchmark PCMC-pad convection cooling limits

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Benchmark PCMC-pad sensible heat effect

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Benchmark PCMC-pad, on–off power loading effect

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Figure 2

PTES-volume section view



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