Research Papers

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

[+] Author and Article Information
D. Sujan1

e-mail: d.sujan@curtin.edu.my

Dereje E. Woldemichael

e-mail: dereje@curtin.edu.my School of Engineering and Science, Curtin University, Sarawak Malaysia, CDT 250, 98009 Miri, Sarawak, Malaysia

M. V. V. Murthy

 Quest global consultancy service,Quest, Bangalore 560085, India e-mail: mvvmurthy@yahoo.com

K. N. Seetharamu

 P.E.S.Institute of Technology, 100 Feet Ring Road, BSK III Stage, Bangalore 560085, India e-mail: knseetharamu@yahoo.com


Corresponding author.

J. Electron. Packag 133(4), 041014 (Dec 21, 2011) (6 pages) doi:10.1115/1.4005294 History: Received February 11, 2011; Revised September 13, 2011; Accepted September 15, 2011; Published December 21, 2011; Online December 21, 2011

When two thin plates or layers are bonded together, an extremely thin bond layer of third material exists between the two layers. This research work examines the effect of bond layer on the interfacial shearing and peeling stresses in a bimaterial model. Earlier papers on this topic are based on several mutually contradictory expressions for the shear compliance of the bond layer. This paper is aimed at resolving this ambiguity and presents derivation of shear compliance on a rational basis. A numerical example is carried out for a silicon-copper system with a gold-tin solder bond layer. The results obtained are likely to be useful in interfacial stress evaluation and physical design of bimaterial assemblies used in microelectronics and photonics applications.

Copyright © 2011 by American Society of Mechanical Engineers
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Figure 1

Schematic presentation of shear stress and displacement

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Figure 2

Shear stress variation along plane AB

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Figure 3

(a) Geometric and material parameters and (b) free-body diagram of the model

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Figure 4

Shearing stress along the interface of bimaterial assembly

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Figure 5

Peeling stress along the interface of bimaterial assembly

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Figure 6

FEM analysis of shearing stress along the interface with compliance and stiff bond thickness (h0 ) as a parameter

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Figure 7

Shearing stress along the interface with compliance bond layer thickness (h0 ) as a parameter

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Figure 8

Peeling stresses along the interface with bond layer thickness (h0 ) as a parameter



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