The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations

[+] Author and Article Information
Ningbo Liao1

College of Mechanical and Electrical Engineering,  Wenzhou University, Wenzhou 325035, P.R. Chinalnb55@163.com

Ping Yang

Research Center of Micro-Nano Science and Technology,  Jiangsu University, Zhenjiang 212013, P.R. China

Miao Zhang, Wei Xue

College of Mechanical and Electrical Engineering,  Wenzhou University, Wenzhou 325035, P.R. China


Corresponding author.

J. Electron. Packag 133(2), 020901 (Jun 07, 2011) (4 pages) doi:10.1115/1.4003513 History: Received November 24, 2009; Revised January 17, 2011; Published June 07, 2011; Online June 07, 2011

Heat transfer across the interfaces of dissimilar materials is a critical consideration in a wide variety of scientific and engineering applications. In this paper, molecular dynamics (MD) simulations are conducted to investigate the effects of thermal loading on mechanical properties of Al–Cu and Cr–Cu interfaces. The mechanical properties are investigated by MD simulations of nanoindentation. Both the results of MD simulations and experiments show the Young’s modulus decrease after thermal cycling, and the Cr–Cu interface is more sensitive to the thermal loading than the Al–Cu interface. The thermal loading and mechanical test models proposed here can be used to evaluate interfacial properties under the effects of heat transferring.

Copyright © 2011 by American Society of Mechanical Engineers
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Figure 1

The initial model configuration

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Figure 2

The initial configuration of nanoindentation simulation

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Figure 3

Three snapshots at the different stage of the indentation process for Cu–Al model

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Figure 4

Comparison on Young’s modulus obtained from experiments and MD simulation: (a) Cu–Al interface and (b) Cu–Cr interface

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Figure 5

The reduction ratio of E after thermal loading for Cu–Cr and Cu–Al interfaces



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