Technical Briefs

Flip-Chip Interconnect for Coplanar Strip Lines

[+] Author and Article Information
Young K. Song

Electrical Engineering and Computer Science, University of California, Irvine, CA 92697-2625

Chin C. Lee

Electrical Engineering and Computer Science, University of California, Irvine, CA 92697-2625cclee@uci.edu

J. Electron. Packag 130(4), 044501 (Nov 17, 2008) (4 pages) doi:10.1115/1.2993140 History: Received December 11, 2007; Revised April 09, 2008; Published November 17, 2008

A flip-chip interconnect configuration with coplanar strip (CPS) lines on printed circuit boards (PCBs) is reported for millimeter-wave applications. For CPS lines, the signal and ground electrodes both lie on the top surface of a chip or substrate. The flip-chip configuration was designed and implemented using a test chip on a dielectric board. Geometrical parameter analysis was carried out using full-wave simulation and equivalent circuit model for wideband performance. The chip was connected to the board using solder bumps. For a typical flip-chip assembly, the measured insertion loss is less than 3dB for frequencies of up to 35GHz and the return loss is higher than 15dB for frequencies of up to 29GHz using CPS flip-chip configuration.

Copyright © 2008 by American Society of Mechanical Engineers
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Figure 1

Cross section end views of (a) microstrip line, (b) CPW, (c) CPS line with dielectric backside, and (d) CPS line with metallized backside

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Figure 2

A new flip-chip interconnect configuration with coplanar strip (CPS) lines.

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Figure 3

(a) Geometrical design parameters of CPS flip-chip interconnect, (b) CPS line on chip side, (c) CPS lines and solder balls on the board. CPS lines have electrode width of 850μm, gap of 60μm, and electrode thickness of 17μm. The thicknesses of the board and chip are 535μm and 385μm, respectively. The board is TMM10 (9) with permittivity of 9.2, loss tangent of 0.0022, and 0.5oz copper cladding. Pitch distance d between solder balls is 790μm. Conductor-overlap length (CO) is 380μm. Dielectric-overlap length (DO) is 100μm.

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Figure 4

Equivalent circuit model of solder bump interconnect

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Figure 5

Optical picture and X-ray image the flip-chip assembly

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Figure 6

Return loss (S11) and insertion loss (S21) of a typical flip-chip assembly.



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