Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

[+] Author and Article Information
Hai Bo Fan1

Department of Mechanical Engineering,  Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kongmehaibo@ust.hk

Edward K. L. Chan, Cell K. Y. Wong, Matthew M. F. Yuen

Department of Mechanical Engineering,  Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong


Corresponding author.

J. Electron. Packag 129(1), 35-40 (Mar 14, 2006) (6 pages) doi:10.1115/1.2429707 History: Received July 26, 2005; Revised March 14, 2006

Interfacial failure under thermal cycling conditions is one of the main concerns in package design. To minimize such failure in multi-layered electronic assemblies and packages, it is important to develop a better understanding of the reliability at a molecular level. In this paper, molecular dynamics (MD) simulations were conducted to investigate the interfacial energy of the epoxy molding compound (EMC) cuprous oxide system during the thermal cycling test. In order to investigate the effect of the cuprous oxide content in the copper substrate on the interfacial adhesion, two kinds of MD models were examined in this study. The results revealed that the cuprous oxide content in the copper substrate had a large effect on the interfacial adhesion between the EMC and copper, which is consistent with the experimental observation.

Copyright © 2007 by American Society of Mechanical Engineers
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Figure 1

Reaction of a curing agent with four epoxy resins

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Figure 2

Molecular model of a fragment of the EMC after the conformation

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Figure 3

MD model of the EMC and cuprous oxide system

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Figure 4

Cuprous oxide content against thermal cycles

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Figure 5

A thermal cycling test profile

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Figure 6

Schematic drawing of the bi-material system deformation during (a) the heating step and (b) the cooling step

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Figure 7

Snapshots of the system after (a) 0 thermal cycle, (b) 600 thermal cycles, (c) 1200 thermal cycles, and (d) 1800 thermal cycles from the MD simulations

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Figure 8

Interfacial bonding energy against thermal cycles



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