Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

[+] Author and Article Information
Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht

CALCE Electronic Products and Systems Center, Department of Mechanical Engineering,  University of Maryland, College Park, MD 20742

Robin Ferebee

 NASA, Marshall Space Flight Center, Huntsville, AL 35812

J. Electron. Packag 128(4), 339-345 (Jan 08, 2006) (7 pages) doi:10.1115/1.2351897 History: Received March 29, 2005; Revised January 08, 2006

This paper presents an analysis of an unexpected failure during vibration and shock life test of an electronic circuit board that has been in use for more than 15 years. During testing, an aluminum bracket used to mount a transistor and provide a path for heat transfer was damaged. Prognostic methods were employed to determine whether the bracket failure could have been predicted prior to the life test. Details of the analytical calculations and modeling results are described in this paper. Results show that the failure could have been predicted before actual testing.

Copyright © 2006 by American Society of Mechanical Engineers
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Figure 4

The sequence in which the life test was conducted

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Figure 5

Aluminum bracket that failed during the life testing

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Figure 1

Printed circuit board from the integrated electronic assembly box under test

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Figure 2

Vibration history of the integrated electronic assembly box for one booster flight

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Figure 3

Low power spectral density profile generated for the life test

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Figure 9

Cantilever beam with uniformly distributed load

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Figure 10

The shock profile for the assembly in the Y axis

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Figure 6

Bracket as a cantilever beam with uniformed load

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Figure 7

Model of aluminum bracket and transistor, showing the maximum stress is at bend of the bracket

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Figure 8

Model of full aluminum frame and transistors



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