Moisture Absorption and Diffusion Characterization of Molding Compound

[+] Author and Article Information
Xu Chen1

School of Chemical Engineering and Technology,  Tianjin University, Tianjin 300072, People’s Republic of China

Shufeng Zhao

School of Chemical Engineering and Technology,  Tianjin University, Tianjin 300072, People’s Republic of China

Linda Zhai

 Freescale Semiconductor Inc., Tianjin 300072, People’s Republic of China


Corresponding author. Tel: 86-22-27408399 Fax: 86-22-87893037 e-mail: xchen@eyou.com

J. Electron. Packag 127(4), 460-465 (Jan 21, 2005) (6 pages) doi:10.1115/1.2065707 History: Received October 01, 2004; Revised January 21, 2005

The moisture absorption experiments of two kinds of molding compound are conducted. The diffusion at low temperature and humidity observes the Fick’s Law, but it does not strictly obey at higher temperature and humidity. The phenomena can be attributed to the occurrence of the second phase, and the Fick’s Law can be modified by diffusion coefficient varying with the moisture concentration. The predicted value by the modified Fick’s Law agrees with the test data. At certain temperature, the saturated moisture content of molding compound is proportional to the relative humidity, and the proportional factor is the product of solubility and saturated vapor pressure. The solubility is a physical characteristic, which has no relations with the relative humidity of ambient air.

Copyright © 2005 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Figure 1

Comparison of the approximate function and theoretical function

Grahic Jump Location
Figure 2

Test data and Fickian curve of moisture absorption of molding compound MP8000

Grahic Jump Location
Figure 3

Test data and Fick’s curve of moisture absorption of molding compound CEL9220M

Grahic Jump Location
Figure 4

Relation between diffusion coefficient and average moisture content, (a) MP8000 at 85°C∕85%RH;(b) MP8000 at 85°C∕60%RH;(c) CEL9220M at 85°C∕85%RH;(d) CEL9220M at 85°C∕60%RH

Grahic Jump Location
Figure 5

The moisture distribution along the thickness of the infinite plate (MP8000, 85°C∕85%RH)

Grahic Jump Location
Figure 6

The numerical result of MP8000 while D is not constant

Grahic Jump Location
Figure 7

The numerical result of CEL9220M while D is not constant



Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In