Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

[+] Author and Article Information
Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause

Final Manufacturing Technology Center, Semiconductor Products Sector, Motorola Inc., 2100 Elliot Road, Mail Drop EL 725, Tempe, AZ 85284

J. Electron. Packag 126(4), 429-434 (Jan 24, 2005) (6 pages) doi:10.1115/1.1827257 History: Received April 19, 2004; Revised July 01, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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Adams, V., Ramakrishna, K., Lee, T.-Y., Hause, J. V., and Mahalingam, M., 1999, “Design-Based Thermal Performance Evaluation of a GaAs MMIC Device in a Plastic Ball Grid Array Package,” Proc. Inter-Society Electronic Packaging Conference (InterPACK ’99), EEP-Vol. 26-1, pp. 277–285.
Johnson, Z., Ramakrishna, K., Joiner, B., and Eyman, M., 1997, “Thermal Sub-Modeling of Wirebonded Plastic Ball Grid Array Package,” Proc. Thirteenth Semi-Therm Symp., Austin, TX, pp. 1–9.
Application Notes for Surface Mount Assembly of Amkor’s MicroLeadFrame (MLF) Packages, March 2001, Internal Report, Revision B.
JESD51-5, “Extension of Thermal Test Board Standards for Packages With Direct Thermal Attachment Mechanisms,” EIA/JEDEC Standard, February 1999.
JESD51-7, “High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages,” EIA/JEDEC Standard, February 1999.
CINDAS Material Property Database, Purdue University, West Lafayette, IN, 1997.
FLOTHERM® Version 3.2, Flomerics Ltd., Surrey England, 2001.
Chiriac, V. A., and Lee, T., 2001, “Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance Analysis,” ASME IMECE, New York, NY, 14–16 Nov.
Thermal Vision 900 Series User Manual, Publication No. 557-020 Ed. No. 1, FLIR Systems, Inc., Danderyd, Sweden, 1994.


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QFN package thermal trends (Rja vs body size)
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Typical QFN package cross section
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3D view of the QFN package layout
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GaAs die layout (top view)
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Die attached to copper paddle and wire bonded
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QFN package cross-sectional view—four layer PCB
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5×5 PQFN package top view
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(a,b) Free convection setup—flow and thermal fields
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QFN die surface—extreme case (0.194 W+0.814 W)
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QFN die surface—typical case (0.111 W+0.546 W)
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PQFN die surface—extreme case (0.194 W+0.814 W)
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Uncapped package/substrate stack-up on test fixture
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IR measurement test fixture—general view
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(a,b) dc power is applied to first and to both heat stages
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(a,b) Simulation vs IR measurement thermal fields



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