Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

[+] Author and Article Information
Woon-Seong Kwon, Hyoung-Joon Kim, Kyung-Wook Paik, Se-Young Jang, Soon-Min Hong

J. Electron. Packag 126(2), 202-207 (Jul 08, 2004) (6 pages) doi:10.1115/1.1756143 History: Received May 01, 2003; Revised November 01, 2003; Online July 08, 2004
Copyright © 2004 by ASME
Your Session has timed out. Please sign back in to continue.


Yim,  M. J., and Paik,  K. W., 1999, “The Contact Resistance and Reliability of Anisotropically Conductive Film (ACF),” IEEE Trans. Of Advanced Packaging, 22(2), pp. 166–173.
Reinert,  W., and Harder,  T., 1996, “Anisotropically Conductive Adhesives for Flip-Chip Bonding on Rigid and Flexible Printed Circuit Substrates,” IEEE Trans. CPMT, Part B: Advanced Packaging, 19(3), pp. 644–660.
Garrou,  P., Scheck,  D., Im,  J. H., Hetzner,  J., Meyers,  G., Hwan,  D., Wu,  J., Vincent,  M. B., and Wong,  C. P., 2000, “Underfill Adhesion to BCB (Cyclotene™) Bumping and Redistribution Dielectrics,” IEEE Trans. Of Advanced Packaging, 23(3), pp. 568–573.
Im,  J. H., Shaffer,  E. O., Stokich,  T., Strandjord,  A., Hertzer,  J., Curphy,  J., and Karas,  C., 2000, “On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications,” ASME J. Electron. Packag., 122, pp. 28–33.
Dai,  X., Brillhart,  M. V., Roesch,  M., and Ho,  P. S., 2000, “Adhesion and Toughening Mechanisms at Underfill Interfaces for Flip-Chip-on-Organic-Substrate Packaging,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 23(1), pp. 117–127.
Tong, Q., Ma, B., Xiao, A., Savoca, A., Luo, S., and Wong, C. P., 2002, “Fundamental Adhesion Issues for Advanced Flip Chip Packaging,” Proceedings of the 52nd Electronic Components and Technology Conference, May, San Diego, pp. 1373–1379.
Im, J., et al., 1998, “On Mechanical Reliability of Photo-BCB based thin Film Dielectric Polymer for Electronic Packaging Applications,” Proc. Workshop Mech. Rel. Polymeric Mater. Plastic Packag. IC Devices, Paris, France, p. 191.
Natarajan, B., and Bhattacharayya, B., 1986, Proceedings of 36th Electronic Component Conference, IEEE, pp. 226–231.
Chen,  W. T., and Nelson,  C. W., 1979, “Thermal Stress in Bonded Joints,” IBM J. Res. Dev., 23(2), pp. 179–188.
Jiang,  Z. Q., Huang,  Y., and Chandra,  A., 1997, “Thermal Stresses in Layered Electronic Assemblies,” ASME J. Electron. Packag., 119, pp. 127–132.
Mirman,  H. B., 1991, “Effects of Peeling Stresses in Bimaterial Assembly,” ASME J. Electron. Packag., 113, pp. 431–433.


Grahic Jump Location
Schematic of (a) die shear test for the evaluation of adhesion strength, and (b) three-point bending test for the interface fractography
Grahic Jump Location
Typical load-displacement responses of (a) die shear testing, and (b) three-point bending testing
Grahic Jump Location
Adhesion strength of BCB-passivated die with thermal cycles
Grahic Jump Location
Polariscopic images of (a) SiN and BCB materials showing characteristic colors, (b) die shear fracture surface with thermal cycles, showing residual BCB at the die corner
Grahic Jump Location
SEM micrographs of three point bending fracture surface of PCB-side (a) before thermal cycling, (b) after 1000 thermal cycles, showing cohesive surface (A), BCB striations (B), smooth surface (C), and BCB cracking (D)
Grahic Jump Location
AFM image from area “B” in Fig. 4, showing striations of BCB passivation. (a) Perspective AFM topography, (b) Height profile.
Grahic Jump Location
SEM micrograph showing the passivation cracks. Cracks develop around the circumference of BCB passivation over aluminum pad and interconnect bumps move with the surrounding BCB
Grahic Jump Location
SEM micrographs of PCB-side fracture surface after 1000 thermal cycles. SEM micrograph at the right-center in this figure represents the fracture surface before thermal cycling.
Grahic Jump Location
Optical micrographs of chip-side fracture surface with thermal cycles. Sliding trace, which is on the aluminum pad, was deviated from the original position to die center and aluminum pad also deformed upon thermal cycling.
Grahic Jump Location
Flip chip structure and magnified view of the right corner of silicon die, showing the UBM/gold bump with BCB passivation. Thermal displacement of BCB passivation fatigue the interconnect bump, leading to functional bump failure.



Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In