CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering

[+] Author and Article Information
Ismail Fidan

Department of Manufacturing & Industrial Technology, College of Engineering, Tennessee Tech University, Cookeville, TN 38505-5003 e-mail: ifidan@tntech.edu

J. Electron. Packag 126(1), 173-176 (Apr 30, 2004) (4 pages) doi:10.1115/1.1646422 History: Received March 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
Your Session has timed out. Please sign back in to continue.


Fidan, I., and Kraft, R. P., 2000, “Inline Troubleshooting for Electronics Manufacturing Systems,” Proceedings of the 2000 IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, pp. 338–343, Santa Clara, CA.
Fidan, I., 1996, “The Design, Implementation, and Performance Analysis of a Prototype SMD Automated Rework Cell,” Ph.D. Thesis, Rensselaer Polytechnic Institute, Troy, NY.
Fidan,  I., and Derby,  S., 1995, “Surface-Mount Rework Operations,” Circuits Assembly,6(7), pp. 36–38.
Fidan,  I., Kraft,  R., Ruff,  L., and Derby,  S., 1998, “Designed Experiments to Investigate the Solder Joint Quality Output of a Prototype Automated Surface Mount Replacement System,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 21(3), pp. 172–182.
Fidan,  I., Kraft,  R., Ruff,  L., and Derby,  S., 1998, “Integration Steps of a Fully-Automated Remanufacturing Cell System Used for Fine-Pitch Surface Mounted Devices,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 21(1), pp. 71–78.
Primavera,  A. A., 2000, “The Influence of PCB Parameters on Assembly and Reliability,” Advanced Packaging, pp. 29–52.
Prasad, R. P., 1997, Surface Mount Technology: Principles and Practice, Chapman & Hall.
Haslehurst,  L., and Ekere,  N. N., 1996, “Parameter Interactions in Stencil Printing of Solder Paste,” Journal of Electronics Manufacturing,6(4), pp. 307–316.
Pan, J., Tonkay, G. L., Storer, R. H., Sallade, R. M., and Leandri, D. J., 1999, “Critical Variables of Solder Paste Stencil Printing for Micro-BGA and Fine Pitch QFP,” Proceedings of the 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium, pp. 94–101.
Oyama, K., 1993, “Overview of Placement and Bonding Technology for 1005 Components and 3 mm-Pitch LSIs: an Equipment Perspective,” pp. 77–108, Surface Mount Technology Recent Japanese Development, IEEE Press.
Pau, L. F., 1990, Computer Vision for Electronics Manufacturing, Plenum Publishing Corporation.
Groover, M. P., Weiss, M., Nagel, R. N., and Odrey, N. G., 1986, Industrial Robotics: Technology, Programming, and Applications, McGraw-Hill.
Lyman,  J., 1989, “Surface-Mounted Placement Software,” Electronic Design,pp. 104–105.
Hinch, S. W., 1988, Handbook of Surface Mount Technology, Longman Scientific & Technical.
Peace, G. S., 1993, Taguchi Methods: A Hands-On Approach To Quality Engineering, Addison-Wesley Publishing Company.


Grahic Jump Location
Fully-automated PCBA manufacturing and remanufacturing cell system developed by the author
Grahic Jump Location
PCBA yield causes and effects
Grahic Jump Location
The number of factors in dispensing affecting solder joint quality output 9
Grahic Jump Location
CAPP tool developed for fine pitch SMT laser soldering
Grahic Jump Location
Visual inspection of joints reflowed by laser



Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In