Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

[+] Author and Article Information
Xianjie Yang, C. L. Chow

Department of Mechanical Engineering, University of Michigan-Dearborn, Dearborn, MI 48120

K. J. Lau

Department of Mechanical Engineering, Hong Kong Polytechnic University, Hong Kong, People’s Republic of China

J. Electron. Packag 126(1), 148-158 (Apr 30, 2004) (11 pages) doi:10.1115/1.1649246 History: Received March 01, 2003; Revised September 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
Your Session has timed out. Please sign back in to continue.


Chow,  C. L., and Wei,  Y., 1999, “Constitutive Modeling of Material Damage for Fatigue Failure Prediction,” Int. J. Damage Mech., 8, pp. 355–374.
Wei,  Y., and Chow,  C. L., 2001, “A Damage-Coupled TMF Constitutive Model for Solder Alloy,” Int. J. Damage Mech., 10(2), pp. 133–152.
Basaran,  C., and Yan,  C. Y., 1998, “A Thermodynamic Framework for Damage Mechanics of Solder Joints,” ASME J. Electron. Packag., 129, pp. 379–384.
Solomon,  H. D., 1986, “Creep, Strain Rate Sensitivity and Low Cycle Fatigue of 60/40 Solder,” Brazing and Soldering, 11, pp. 68–75.
Busso,  E. P., Kitano,  M., and Kumazawa,  T., 1994, “Modeling Complex Inelastic Deformation Processes in IC Packages’ Solder Joints,” ASME J. Electron. Packag., 116, pp. 6–15.
McDowell, D. L., Miller, M. P., and Brooks, D. C., 1994, “A Unified Creep-Plasticity Theory for Solder Alloys,” Fatigue of Electronic Materials, ASTM STP 1153, pp. 42–59.
Frear,  D. R., Burchett,  S. N., Neilsen,  M. K., and Stephens,  J. J., 1997, “Microstructurally Based Finite Element Simulation of Solder Joint Behavior,” Soldering & Surface Mount Technology, 2, pp. 39–42.
Qian,  Z., Ren,  W., and Liu,  S., 1999, “A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys,” ASME J. Electron. Packag., 121, pp. 162–168.
Simo,  J. C., and Taylor,  R. L., 1986, “A Return Mapping Algorithm for Plane Stress Elastoplasticity,” Int. J. Numer. Methods Eng., 22, pp. 649–670.
Lof,  J., and van den Boogaard,  A. H., 2001, “Adaptive Return Mapping Algorithms for J2 Elasto-Viscoplastic Flow,” Int. J. Numer. Methods Eng., 51, pp. 1283–1298.
Johansson,  M., Mahnken,  R., and Runesson,  K., 1999, “Efficient Integration Technique for Generalized Viscoplasticity Coupled to Damage,” Int. J. Numer. Methods Eng., 44, pp. 1727–1747.
Qian, Z., and Liu, S., 1999, “Implementation of Unified Viscoplasticity with Damage Evolution and Its Application to Electronic Packaging,” EEP-Vol.26-2, Advances in Electronic Packaging, Vol. 2, pp. 2099–2106.
Fu,  C., McDowell,  D. L., and Ume,  I. C., 1998, “A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects,” ASME J. Electron. Packag., 120, pp. 24–34.
ABAQUS, 2001, ABAQUS/Standard User’s Manual, Hibbitt, Karlsson & Sorenson, Inc., Pawtucket, RI, Version 6.2.
Lush,  A. M., Weber,  G., and Anand,  L., 1989, “An Implicit Time-Integration Procedure for a Set of Internal Variable Constitutive Equations for Isotropic Elasto-Viscoplasticity,” Int. J. Plast., 5, pp. 521–549.


Grahic Jump Location
Numerical simulation of monotonic stress-strain curve under pure shear loading
Grahic Jump Location
Numerical simulation of cyclic stress-strain relationship under pure shear cyclic loading
Grahic Jump Location
Numerical results of cyclic stress response under nonproportional loading



Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In