Research of Underfill Delamination in Flip Chip by the J-Integral Method

[+] Author and Article Information
Bulu Xu, Xia Cai, Weidong Huang, Zhaonian Cheng

DaimlerChrysler SIM Lab, Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, Shanghai 200050

J. Electron. Packag 126(1), 94-99 (Apr 30, 2004) (6 pages) doi:10.1115/1.1648061 History: Received October 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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Suhir,  E., 1998, “The Future of Microelectronic and Photonics and the Role of Mechanics and Materials,” ASME J. Electron. Packag., 120, pp. 1–11.
Suryanarayana,  D., Hsiao,  R., Gall,  T. P., and McCreary,  J. M., 1991, “Enhancement of Flip Chip Fatigue Life by Encapsulation,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 14, pp. 218–223.
Lau,  J. H., 1996, “Solder Joints Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical and Vibrational Conditions,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, pp. 728–735.
Gektin,  V., Bar-Cohen,  A., and Ames,  J., 1997, “Coffin-Manson Fatigue Model of Underfilled Flip-Chip,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, Sept., pp. 317–325.
Nakano, F. et al., 1987, “Resin Insertion Effect on Thermal Cycle Resistively of Flip Chip Mounted LSI Devise,” Proceedings 1987 ISHM Conference, pp. 536–541.
Tsukada, Y., l994, “Solder Bumped Flip Chip Attach on SLC Board and Multi-Chip Module,” Chips on Board Technologies for Multi-chip Modules, J. H. Lan, ed., New York, Van Nostrand Reinhold, pp. 410–443.
Gurumurthy,  C. K., Jiao,  J., Norris,  L. G., Hui,  C. Y., and Kramer,  E. J., 1998, “A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces,” ASME J. Electron. Packag., 120, pp. 372–378.
Kook,  S.-Y., Snodgrass,  J. M., Kirtikar,  A., and Dauskardt,  R. H., 1998, “Adhesion and Reliability of Polymer/Inorganic Interfaces,” ASME J. Electron. Packag., 120, pp. 328–335.
Wang,  Jianjun, Lu,  Minfu, Zou,  Daqing, and Liu,  Sheng, 1998, “Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 21(1), pp. 79–85.
Wang,  Jianjun, Zou,  Daqing, Lu,  Minfu, Ren,  Wen, and Liu,  Sheng, 1999, “Evaluation of Interfacial Fracture Toughness of a Flip-Chip Package and a Bimaterial System by a Combined Experimental and Numerical Method,” Eng. Fract. Mech., 64, pp. 781–795.
Yao,  Qizhou, Qu,  Jianmin, Wu,  Jiali, and Wong,  C. P., 1999, IEEE Trans. Electronic Packaging Manufact., 22(4), pp. 264–267.
Lau,  John H., Ricky,  S.-W., Ricky,  S.-W., and Chang,  Chis, 2000, “Effects of Underfill Material Properties on the Reliability of Solder Bumped Flip Chip on Board With Imperfect Underfill Encapsulants,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 23(2), pp. 323–332.
Zhang,  Q., Xie,  X. M., Chen,  L., Wang,  G. Z., Cheng,  Z. N., and Kempe,  W., 2000, “On the Degradation of the Solder Joints of Underfilled Flip Chip Packages: A Case Study,” Soldering & Surface Mount Technology, 12(3), pp. 24–28.
Chen,  L., Zhang,  Q., Wang,  G. Z., Xie,  X. M., and Cheng,  Z. N., 2001, “The Effects of Underfill and Its Material Models on Thermomechanical Behaviors of Flip Chip Package,” IEEE Trans., 24(1), pp. 17–24.
Cheng,  Z. N., Wang,  G. Z., Chen,  L., Wilde,  J., and Becker,  K., 2000, “Viscoplastic Anand Model for Tin-Lead Based Solders and Its Application,” Soldering & Surface Mount Technology, J. of SMART, 12(2), pp. 31–36.
Wilde, J., Cheng, Z. N., and Wang, G. Z., 1999, “Influences of Packaging Materials on Solder Joint Reliability of Chip Scale Package Assemblies,” Proc. 1999 Int. Symp. Adv. Packag. Mater., Braselton, GA, Mar. 14–17, pp. 144–149.
Rice,  J. R., and Sih,  G. C., 1965, “A Path Independent Integral and the Approximate Analysis of Strain Concentration by Notches and Cracks,” ASME J. Appl. Mech., 35, pp. 379–386.
Weichen,  Shi, and Bangkuang,  Zhen, 1999, “J-Integal of Dissimilar Anisotropic Media,” Int. J. Fract., 96, pp. 37–42.
Suo,  Z., 1990, “Singularities, Interfaces and Cracks in Dissimilar Anisotropic Media,” Proc. R. Soc. London, Ser. A, 427, pp. 331–358.


Grahic Jump Location
Finite element meshes of D type of flip chip assembly containing a pre-crack between chip and underfill (a) and local fine mesh near crack tip (b)
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Flat rectangle path contour around crack tip for calculating J-integral
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J-integral calculated with different path parameters (a) and enlarged view of b/a range 0∼0.5 (b)
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Delamination propagation rate da/dn and energy release rate ΔG of flip chip assemblies tested
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Dependence of delamination crack length on the number of thermal cycles for samples of type B and D
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Schematic 2D structure containing a pre-crack on the interface between chip and underfill in flip chip assembly



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