An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

[+] Author and Article Information
S. Shakya

Pujara Wirth Torke, Inc., Wauwatosa, WI 53226

S. M. Heinrich

Department of Civil and Environmental Engineering, Marquette University, Milwaukee, WI 53201-1881

P. S. Lee

Rockwell Automation, Milwaukee, WI 53204

J. Electron. Packag 126(1), 74-81 (Apr 30, 2004) (8 pages) doi:10.1115/1.1648058 History: Received December 01, 2002; Online April 30, 2004
Copyright © 2004 by ASME
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Grahic Jump Location
(a) Geometric and material parameters of assembly (b) geometric and material parameters of a typical solder joint; (c) definition of shear displacement Δu
Grahic Jump Location
The equivalent axisymmetric assembly, comprising a homogeneous elastic component and substrate and a uniform viscoelastic solder layer
Grahic Jump Location
Dimensionless plots of Δumax(t)/Δuo vs. t/q for the case of step-function thermal loading
Grahic Jump Location
Dimensionless plots of βve vs. ωq for the case of sinusoidal load. Each family of curves shares the same asymptotic value (βo).
Grahic Jump Location
Comparison plots of frequency correction factors: present study (βve) vs. previous study (Cf)9



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