Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces

[+] Author and Article Information
L. L. Meekisho

Portland State University, Portland, OR 97207

K. Nelson-Owusu

Washington County, LUT, 155 N First Ave MS 350-12, Hillsboro, OR 97124

J. Electron. Packag 126(1), 52-56 (Apr 30, 2004) (5 pages) doi:10.1115/1.1646429 History: Received June 01, 2003; Online April 30, 2004
Copyright © 2004 by ASME
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Meekisho,  L., and Nelson-Owusu,  K., 2004, “Interfacial Bond Stress Relationship for Gullwing Solder Joints,” ASME J. Electron. Packag., in press.
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Grahic Jump Location
Cross section of gullwing leadframe solder joint geometry (a) arbitrary solder shape (b) an enlarged solder fillet described by the governing equation
Grahic Jump Location
Von Mises stress contours
Grahic Jump Location
Peeling (bond) shear stress contours



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