Three- and Four-Point Bend Testing for Electronic Packages

[+] Author and Article Information
Santosh Shetty, Tommi Reinikainen

Nokia Inc., 6000, Connection Drive, Irving, Texas 75039, USA

J. Electron. Packag 125(4), 556-561 (Dec 15, 2003) (6 pages) doi:10.1115/1.1604158 History: Received November 01, 2002; Online December 15, 2003
Copyright © 2003 by ASME
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Darveaux, R., and Banerji, K., 1992, “Constitutive Relations for Tin Based Solder Joints,” Electronic Components and Technology Conference, San Diego, California, May 18–20, pp. 538–551. 15 , pp. 1013–1024.
Darveaux, R. 2000, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation,” Electronic Components and Technology Conference, Las Vegas, Nevada, May 21–24, pp. 1048–1058.
Darveaux, R., 1997, “Solder Joint Fatigue Life Model,” Proceedings TMS.
Shetty, S., Dasgupta, A., Halkola, V., Lehtinen, V., Reinikainen, T., 2000, “Bending Fatigue Of Chip Scale Package Interconnects,” ASME International Mechanical Engineering Congress and Exposition, Orlando, Florida, Nov. 5–10.
Shetty, S., 2000, “Effect Of Cyclic Bending On Chip Scale Package Assemblies,” M.S. thesis, Dept. of Mechanical Engineering, University of Maryland, College Park.
Zhu,  J., 1999, “Three-Dimensional Effects of Solder Joints in Micro-Scale BGA Assembly,” ASME J. Electron. Packag., 121, pp. 121–302.


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Cross-section image showing the failure site
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Local model simulation results (row 1). (a) Displacement contour; (b) strain energy density (corner critical solder joint).
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Global simulation results
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Finite element model used for local simulations. (a) Local model (row 0 components); (b) local model (row 1 components and on); (c) sectional view of the local model; (d) finite element mesh of the noncritical solder joint; (e) finite element mesh of the critical solder joint.
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Finite element models used for global simulation. (a) Global model; (b) simplified package used in the global model.
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Bending fatigue test results. (a) Packages on the top; (b) packages on the bottom.
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Schematic of the three-point bend test fixture and curvature distribution along the test specimen
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Bending test specimen with 66 CSPS
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Strain energy density averaging
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Reliability model (correlating simulations with experiments)
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Correlation between the simulation and experimental results
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Schematic of four-point bending model
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Boundary conditions (four-point bend)
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Four-point bending global simulation. (a) Deformation contour; (b) von Mises Stress contour (solder joints).



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