Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

[+] Author and Article Information
Ravi S. Prasher, Paul Koning, James Shipley, Amit Devpura

Intel Corporation, 5000 W. Chandler Blvd., Chandler, AZ 85226-3699

J. Electron. Packag 125(3), 386-391 (Sep 17, 2003) (6 pages) doi:10.1115/1.1602703 History: Received September 01, 2001; Revised March 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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Measured thermal contact conductance of a sodium silicate based thermal interface material, as a function of volume percentage of boron nitride (BN) particles, normalized with respect to hc for no BN particles (Ref. 10)
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Schematic showing the various components of thermal resistances after the insertion of a thermal interface material
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(a) Interface tester for thermal conductivity and thermal resistance measurement, (b) Use of spacers to measure the thermal conductivity
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Thermal impedance versus BLT for different particle volume fractions for the measurement of thermal conductivity
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Thermal conductivity versus particle volume fraction
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Contact resistance versus particle volume fraction for the measurement with spacers
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Mechanical length parameter versus particle volume fraction for various pressures
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Mechanical length parameter versus v/P



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