Simplification of Finite Element Models for Thermal Fatigue Life Prediction of PBGA Packages

[+] Author and Article Information
Hasan U. Akay

Yan Liu

Computational Mechanics Laboratory, Mechanical Engineering Department, Indiana University-Purdue University Indianapolis (IUPUI), Indianapolis, IN 46202

Mostafa Rassaian

Boeing Phantom Works, Structures Technology, Seattle, WA 98124

J. Electron. Packag 125(3), 347-353 (Sep 17, 2003) (7 pages) doi:10.1115/1.1569956 History: Received September 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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Grahic Jump Location
(a) Top view of the ball-grid array of a typical PBGA package; (b) cross section of a typical PBGA package; (c) cross section of a typical PBGA package with a metal core
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(a) A typical 1/8th FE model for PBGA package; (b) A typical sliced 3-D FE model for a PBGA package; (c) A typical 2-D FE model for a PBGA package
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Comparison of creep dissipation energy from different FE models of 225-I/O PBGA
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Curve-fitting for PBGA and conventional SMT packages by using different FE models
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Comparison of prediction with experiments of three FE models for six types of PBGAs
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Comparison of prediction with experiments of 2-D FE models for six types of SMTs



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