Packaging of Optical MEMS Devices

[+] Author and Article Information
Yee L. Low, Ronald E. Scotti, David A. Ramsey, Cristian A. Bolle

Lucent Technologies Bell Labs, Murray Hill, NJ, 07974

Steven P. O’Neill, Khanh C. Nguyen

Agere Systems, Breinigsville, PA 18031

J. Electron. Packag 125(3), 325-328 (Sep 17, 2003) (4 pages) doi:10.1115/1.1535933 History: Received April 12, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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Walker,  J. A., 2000, “The Future of MEMS in Telecommunications Networks,” J. Micromech. Microeng., 10, R1–R7.
Dakuginow, S., 2000, “Packaging the Digital Micromirror Device,” 2nd IEEE Optoelectronics Packaging Workshop, ID October 4–6.
Greenhouse, H. 1999, Hermeticity of Electronics Packages, Noyes Publications, Park Ridge, NJ.
Ford,  J. E., and Walker,  J. A., 1998, “Dynamic Spectral Power Equalization Using Micro-Opto-Mechanics,” IEEE Photonics Technol. Lett., 10(10), Oct., pp. 1440–1442.
Neilson, D. T., Aksyuk, V. A., Arney, S., Basavanhally, N. R., Bhalla, K. S., Bishop, D. J., Boie, B. A., Bolle, C. A., Gates, J. V., Gottlieb, A. M., Hickey, J. P., Jackman, N. A., Kolodner, P. R., Korotky, S. K., Mikkelsen, B., Pardo, F., Raybon, G., Ruel, R., Scotti, R. E., Van Blarcum, T. W., Zhang, L., and Giles, C. R., 2000, “Fully provisioned 112×112 micro-mechanical optical crossconnect with 35.8Tb/s demonstrated capacity,” Proc., Optical Fiber Conference, Baltimore, MD.
Dupont Microcircuit Materials, http://www.dupont.com/mcm/product.tape.htlm.


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Packaging of a DGEF device (research prototype)
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Metal header with a DGEF device wire-bonded to flex tapes (research prototype)
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DGEF thin-film ceramic packages with solder attached PWB board and micro connectors
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The design of the DGEF thin-film ceramic package
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The design of the FR-4 board, solder attached to the thin-film ceramic
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Piece parts for thin-film ceramic packages: seal rings, thin film ceramics, PWBs with connectors, fiber sleeve, metal sub-mounts, etc
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The LambdaRouter optical cross-connect switch in a 1024-pin HTCC PGA package
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DGEF integrated LTCC packages with micro connectors, flat flex cables and a fiber attached
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The design of the multi-layer DGEF LTCC package
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The optical cross-connect switch LTCC package



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