Thermoelectric Behavior of Solder

[+] Author and Article Information
Taejin Kim, D. D. L. Chung

Composite Materials Research Laboratory, University at Buffalo, The State University of New York, Buffalo, NY 14260-4400

J. Electron. Packag 125(1), 161-162 (Mar 14, 2003) (2 pages) doi:10.1115/1.1536952 History: Received February 28, 2002; Online March 14, 2003
Copyright © 2003 by ASME
Your Session has timed out. Please sign back in to continue.


Roberts,  R. B., 1985, “Absolute Thermopower of Pb, Cu, and Pt,” CODATA Bull., 59, pp. 47–49.


Grahic Jump Location
Measured Seebeck voltage versus temperature difference during heating and subsequent cooling
Grahic Jump Location
Absolute thermoelectric power versus temperature difference during heating and subsequent cooling



Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In