Impact Resistance of SM Joints Formed With ICA

[+] Author and Article Information
C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung

Department of Physics and Materials Science, City University of Hong Kong, Hong Kong

J. Electron. Packag 125(1), 93-97 (Mar 14, 2003) (5 pages) doi:10.1115/1.1534842 History: Received May 01, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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Westphal, H., 1999, “Health and Environmental Aspects of Conductive Adhesives—The Use of Lead-Based Alloys Compared With Adhesives,” Conductive adhesives for electronics packaging, ed., J. Liu, p. 416.
Kolsky,  H., 1949, “An Investigation of the Mechanical Properties of Materials at Very High Strain Rates of Loading,” Proc. Phys. Soc. London, Sect. B, 62, p. 767.
Liu. J, 1999, “Introduction to Conductive Adhesive Joining Technology,” Conductive Adhesives for Electronics Packaging, ed. J. Liu, pp. 9–11.
Hamouda,  A. M. S., and Hashmi,  M. S. J., 1998, “Testing of Composite Materials at High Rates of Strain: Advances and Challenges,” J. Mater. Process. Technol., pp. 327–336.
Karihaloo B. L., Y. W. Mai, M. I. Ripley, and R. O. Ritchie, 1997, High Strain Rate Fracture and Impact Mechanics, Pergamon, Vol. 6, pp. 2743–2754.
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Grahic Jump Location
Schematic diagram of split Hopkinson bar
Grahic Jump Location
Schematic diagram of 3-point bending
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Schematic diagram of set up of three-point bend test within a split Hopkinson bar
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Variation of strain rate with time
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Schematic diagram of shear test
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Voids in the fillet of the ICA joint
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Voids found in the ICA between resistor and PCB
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Cross section of the ICA joint
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Shear strength of the ICA
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Position of crack in the SM ICA joint
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Interface crack between resistor and ICA



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