Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

[+] Author and Article Information
Timothy Ferguson, Jianmin Qu

Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 124(2), 106-110 (May 02, 2002) (5 pages) doi:10.1115/1.1414133 History: Received July 12, 2000; Revised April 24, 2001; Online May 02, 2002
Copyright © 2002 by ASME
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Vroonhoven,  J., 1993, “Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits,” ASME J. Electron. Packag., 115, pp. 28–33.
Soles,  C., Chang,  T., Gidley,  D., and Yee,  A., 2000, “Contributions of the Nanovoid Structure to the Kinetics of Moisture Transport in Epoxy Resins,” J. Polym. Sci., Part B: Polym. Phys., 38, pp. 776–791.
Wong, C. P., Shi, S., and Jefferson, G., 1997, “High Performance No-Flow Underfill for Low-Cost Flip-Chip Applications,” IEEE Electronic Components and Technology Conference, pp. 850–858.
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Malyshev,  B., and Salganik,  R., 1965, “The Strength of Adhesive Joints Using the Theory of Cracks,” Int. J. Fract. Mech., 1, pp. 114–128.
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Ferguson, T., and Qu, J., 2001, “Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials,” accepted for publication in the ASME J. Electron. Packag.


Grahic Jump Location
Loading diagram for a bimaterial with an interface crack
Grahic Jump Location
Percent weight gain of UR-A interfacial fracture test specimens at 85°C/85%RH
Grahic Jump Location
Percent weight gain of UR-B interfacial fracture test specimens at 85°C/85%RH
Grahic Jump Location
Interfacial adhesion values for both fully dried and moisture preconditioned test specimens
Grahic Jump Location
Representative load displacement test curve
Grahic Jump Location
Bimaterial test specimen



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