A New Creep Constitutive Model for Eutectic Solder Alloy

[+] Author and Article Information
X. Q. Shi, Z. P. Wang, Q. J. Yang

Gintic Institute of Manufacturing Technology, Nanyang Drive, Singapore 638075

W. Zhou, H. L. J. Pang

School of Mechanical & Production Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798

J. Electron. Packag 124(2), 85-90 (May 02, 2002) (6 pages) doi:10.1115/1.1462624 History: Received September 27, 2000; Online May 02, 2002
Copyright © 2002 by ASME
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Morris, J. W., Jr., Tribula, D., Summers, T. S. E., and Grivas, D., 1991, “The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joints,” Solder Joint Reliability: Theory and Applications, J. Lau, ed. pp. 243–248.
Pao,  Y. H., Badgley,  S., Jih,  E., Govila,  R., and Browning,  J., 1993, “Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints,” ASME J. Electron. Packag., 115, pp. 147–152.
Darveaux,  R., and Banerji,  K., 1992, “Constitutive Relations for Tin-Based Solder Joints,” IEEE CHMT-A, 15, pp. 1013–1024.
Knecht,  S., and Fox,  L. R., 1990, “Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder,” IEEE CHMT-A, 13, pp. 424–433.
Hacke,  P., Sprecher,  A. F., and Conrad,  H., 1993, “Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening,” ASME J. Electron. Packag., 115, pp. 153–158.
Syed,  A. R., 1995, “Creep Crack Growth Prediction of Solder Joints during Temperature Cycling—An Engineering Approach,” ASME J. Electron. Packag., 117, pp. 116–122.
Shi,  X. Q., Zhou,  W., Pang,  H. L. J., and Wang,  Z. P., 1999, “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy,” ASME J. Electron. Packag., 121, pp. 179–185.
Hertzberg, R. W., 1996, Deformation and Fracture Mechanics of Engineering Materials, Wiley, New York.
Frost, H. J., and Ashby, M. F. 1982, Deformation-Mechanism Maps—The Plasticity and Creep of Metals and Ceramics, Pergamon Press, New York.
Kocks, U. F., Argon, A. S., and Ashby, M. F., 1975, Thermodynamics and Kinetics of Slip, Progress in Material Science, Pergamon Press, New York.
McCabe,  R. J., and Fin,  M. E., 1998, “Athermal and Thermally Activated Plastic Flow in Low Melting Temperature Solders at Small Stresses,” Scr. Mater., 39, No. 2, pp. 189–195.
Lau, J., and Pao, Y. H., 1997, Solder Joint Reliability of BGA, Flip Chip, CSP, and Fine Pitch SMT Assemblies, Van Nostrand Reinhold, New York.
Shi,  X. Q., Pang,  H. L. J., Zhou,  W., and Wang,  Z. P., 1999, “A Modified Energy-Based Low Cycle Fatigue Model for Eutectic Solder Alloy,” Scr. Mater., 41, pp. 289–296.


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Creep-time curve obtained at 30 MPa, 25°C
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Steady-state creep behavior at different temperatures
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Stress exponent n as a function of temperature
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Steady-state creep shear strain rate versus reciprocal of absolute temperature
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Activation energy as a function of temperature at a given normalized shear stress level of τ/G=3.5×10−4
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Activation energy as a function of applied normalized shear stress for different temperatures
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63Sn/37Pb normalized steady-state creep behavior
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Comparison on creep shear strain rate obtained from the experimental tests and new creep model
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Cross-sectional view of the plastic BG assembly
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One eighth FE model for a 256 I/O PBGA
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Stress-strain hysteresis loop obtained from ATC simulation



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