Numerical Study of Wire Bonding—Analysis of Interfacial Deformation Between Wire and Pad

[+] Author and Article Information
Yasuo Takahashi

Joining and Welding Research Institute, Osaka University, 11-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japane-mail: taka@jwri.osaka-u.ac.jp

Michinobu Inoue

Graduate School of Osaka University, Osaka, Japane-mail: michinobu.inoue@toshiba.co.jp

J. Electron. Packag 124(1), 27-36 (Mar 13, 2001) (10 pages) doi:10.1115/1.1413765 History: Received March 13, 2001
Copyright © 2002 by ASME
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Purpose and policy of the present study
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Models of wire bonding. (a) by flat tool and (b) by V groove tool.
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Mesh pattern in cross section of wire and pad. (a) For flat tool and (b) for V groove tool.
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Definition of segment number. (a) Ns1 on wire surface and (b) Ns2 on pad and Ns3 on Si-substrate.
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Flow chart of computer simulation
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Folding process of wire to pad surface. Black circles are the nodal points. Nodal point 1 is the junction between wire and pad and point 2 is on the wire surface. Points 3 and 4 are on the pad surface. White circles are the positions of the nodal points immediately after point 2 touches with point 3 (when the y coordinate of point 2 is equal to that of point 3). A new node as a new junction between wire and pad is made from points 2′ and 3′ .
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Schematic illustration of relative size change between wire diameter and pad thickness
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Schematic illustration for definition of reduction (compression ratio). (a) For flat tool and (b) for groove tool.
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Deformed patterns for δo/Ho=0.1 (Ho=10 μm,M=1.0). The bonding load per unit length of wire is Wb=9.8 N/mm, the bonding pressure, P(=Wb/Ho)=980 MPa and the bonding temperature T=573 K. The number on the top of each figure is the displacement rate value at the top of the wire (point E in Fig. 3(a)). (a) ΔH/Ho=0.00%,t=2.00×10−19 s, (b) ΔH/Ho=21.3%,t=9.35×10−5 s, and (c) ΔH/Ho=39.8%,t=7.85×10−3 s.
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Deformed patterns for δo/Ho=0.5 (M=1.0,Wb=9.8 N/mm,P=980 MPa, and T=573 K). (a) ΔH/Ho=0.00%,t=2.00×10−19 s, (b) ΔH/Ho=18.1%,t=6.10×10−5 s, and (c) ΔH/Ho=40.1%,t=1.17×10−2 s.
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Distribution of equivalent stress in wire and pad at ΔH/Ho≈47% (M=1.0,W=9.8 N/mm,P=980 MPa, and T=573 K). (a) δo/Ho=0.1 and (b) δo/Ho=0.5.
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Effect of pad thickness on interfacial extensions. (a) Segment extension of wire surface and (b) segment extension of pad surface.
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Deformation process of wire and pad for M=10−2o/Ho=0.1,W=9.8 N/mm,T=573 K). (a) ΔH/Ho=0.00%,t=2.00×10−19 s, (b) ΔH/Ho=21.1%,t=8.35×10−5 s, and (c) ΔH/Ho=41.4%,t=1.11×10−2 s.
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Effect of M value on stress distribution at ΔH/Ho≈47% (W=9.8 N/mm,T=573 K,δo/Ho=0.1). (a) M=1 and (b) M=10−2.
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Stress distribution on interfaces. (a) Between wire and pad and (b) between pad and substrate.
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Effect of M value on interfacial extension. (a) Segment extension of wire surface and (b) segment extension of pad surface.
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Deformation process in wire bonding by groove (M=1.0,δo/Ho=0.1). (a) ΔH/Ho=0.00%, (b) ΔH/Ho=20.4%, (c) ΔH/Ho=29.8%, and (d) ΔH/Ho=35.9%.
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Effect of shape on interfacial extension. (a) Segment extension of wire surface and (b) segment extension of pad surface.
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Comparison between experimental and calculated results concerning Al wire bonding. (a) Experimental result and (b) calculated result. In (a), wire: Al wire of 300 μm, Pad: Al-Si thin film. Wb=600gf/wire,t=150ms. In (b), wire material: Al, pad material: M=10−2,T=423 K,Wb=14.7 N/mm,t=150 ms and δo/Ho=0.1 were assumed.
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Distribution of equivalent stress in the cross section of wire deformed by groove tool. ΔH/Ho=36%(wire diameter:10μm),Wb=15.68 N/mm,T=573 K,M=1.0 and Material: Au.



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