A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips

[+] Author and Article Information
Boris Mirman

Weidlinger Associates, Inc., Cambridge, MA 02142

Emanuel Bobrov

MIT Plasma Fusion Center, Cambridge, MA 02142

J. Electron. Packag 123(4), 405 (Sep 19, 2000) (1 page) doi:10.1115/1.1400975 History: Received September 19, 2000
Copyright © 2001 by ASME
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Safranek, W. H., 1986, “The Properties of Electrodeposited Metals and Alloys,” Handbook, American Electroplaters and Surface Finishers Society.




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