Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

[+] Author and Article Information
Xiangcheng Luo, Yunsheng Xu, D. D. L. Chung

Composite Materials Research Laboratory, State University of New York at Buffalo, Buffalo, NY 14260-4400

J. Electron. Packag 123(3), 309-311 (Jun 26, 2000) (3 pages) doi:10.1115/1.1371925 History: Received June 26, 2000
Copyright © 2001 by ASME
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Wolff,  E. G., and Schneider,  D. A., 1998, “Prediction of Thermal Contact Resistance between Polished Surfaces,” Int. J. Heat Mass Transf. 41, No. 22, pp. 3469–3482.
Ouellette, T., and de Sorgo, M., 1985, “Thermal Performance of Heat Transfer Interface Materials,” Proceedings, The Power Electronics Design Conf., Power Sources Users Conf., Cerritos, CA, pp. 134–138.
Wilson, S. W., Norris, A. W., Scott E. B., and Costello, M. R., 1996, “Thermally Conductive Adhesives for High Thermally Stressed Assembly,” National Electronic Packaging and Production Conference, Proc. Technical Program, Reed Exhibition Companies, Norwalk, CT, Vol. 2, pp. 788–796.
Peterson, A. L., 1990, “Silicones with Improved Thermal Conductivity for Thermal Management in Electronic Packaging,” Proceedings, 40th Electronic Components and Technology Conf., IEEE, Piscataway, NJ, Vol. 1, pp. 613–619.
Lu,  X., Xu,  G., Hofstra,  P. G., and Bajcar,  R. C., 1998, “Moisture-Absorption, Dielectric Relaxation, and Thermal Conductivity Studies of Polymer Composites,” J. Polym. Sci., Part B: Polym. Phys. 36, No. 13, pp. 2259–2265.
Sasaski, T., Hisano, K., Sakamoto, T., Monma, S., Fijmori, Y., Iwasaki, H., and Ishizuka, M., 1995, “Development of Sheet Type Thermal Conductive Compound Using AIN,” Japan IEMT Symp. Proc., IEEE/CPMT Int. Electronic Manufacturing Technology (IEMT) Symp., IEEE, Piscataway, NJ, pp. 236–239.
Xu, Y., Luo, X., and Chung, D. D. L., “Lithium doped polyethylene-glycol-based thermal interface pastes for high thermal contact conductance,” ASME J. Electron. Packag., in press.
Xu,  Y., Luo,  X., and Chung,  D. D. L., 2000, “Sodium Silicate Based Thermal Pastes for High Thermal Contact Conductance,” ASME J. Electron. Packag. 122, No. 2, pp. 128–131.




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