Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds

[+] Author and Article Information
S. H. Fan, Y. C. Chan, J. K. L. Lai

Department of Electronic Engineering and Department of Physics and Materials Science, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong

J. Electron. Packag 123(3), 290-294 (Jul 14, 1999) (5 pages) doi:10.1115/1.1347997 History: Received July 14, 1999
Copyright © 2001 by ASME
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Typical reflow temperature profile measured near the solder (Ts) and in the ambient gas (T), (a) profile #2, (b) profile #4
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Fatigue lifetime (N50percent cycles) versus the mean coefficient of heat transfer (hm W/(m2⋅°C)) at displacement amplitudes of ±0.21 mm and ±0.28 mm, (a) 169-pin samples, (b) 225-pin
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Fatigue lifetime (N50percent) of samples reflowed by profile #4 versus different cycle displacement amplitudes
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The SEM micrographs of the interfacial microstructures for the solder joints reflowed by (a) profile #1, (b) profile #3, (c) profile #5
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Frictional sliding tracks on the solder side fracture surface of solder/IMC interface crack in a failed solder joint
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Schematic of geometry of solder joint array for calculation of the mean coefficient of forced convection heat transfer
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Cross-sectional view (SEM) of crack in a failed solder joint
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SEM cross-sectional view of initial crack near PCB solder pad



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